物理化学学报 >> 1998, Vol. 14 >> Issue (05): 429-434.doi: 10.3866/PKU.WHXB19980509

研究论文 上一篇    下一篇

Ni-P化学镀反应速率及机理研究

张国栋   

  1. 华东冶金学院化工系,马鞍山 243002
  • 收稿日期:1997-08-27 修回日期:1997-12-17 发布日期:1998-05-15
  • 通讯作者: 张国栋

Study on the Reaction Rate and Mechanism of Ni-P Electroless Plating

Zhang Guo-Dong   

  1. Department of Chemical Engineering,East China Institute of Metallurgy,Ma'anshan 243002
  • Received:1997-08-27 Revised:1997-12-17 Published:1998-05-15
  • Contact: Zhang Guo-Dong

摘要:

 通过镀层分析和析氢量测量得到Ni-P镀层的沉积速度和H2PO2-的分解速度. 以混合电位理论为基础,对Ni-P电极在不同组成镀液中的极化曲线进行分解得到以化学镀电流形式所表示的反应速率. 将两种方法所得结果进行对照,确定H2PO2-氧化时电子迁移数为1,并用原子氢-电化学联合理论解释溶液PH对反应速率及化学镀效率的景响.

关键词: Ni-P化学镀, 混合电位理论, 反应机理

Abstract:

The deposition rate of Ni-P electroless coating and the decomposition rate of H2PO, were studied by analyzing the mass and the P content of the electeroless coating, and by measuring the volume of the evolved hydrogen. Based on the mixed potential theory, electroless plating current, which can be expressed by the reaction rate, was obtained by analyzing the polarzation curves of Ni-P in solutions of various composition. The reaction is consistant with the one electron transfer mechanism. The influnce of the solution pH on electeoless plating rate and electroless plating effeciency was explained.

Key words: Ni-P electroless plating, Mixed porential theory, Reaction mechanism