物理化学学报 >> 1998, Vol. 14 >> Issue (12): 1098-1103.doi: 10.3866/PKU.WHXB19981208

研究论文 上一篇    下一篇

Sn-In-Zn三元系相图和无铅钎料成分的探讨

郑玉军, 张启运   

  1. 北京大学化学与分子工程学院,北京 100871
  • 收稿日期:1998-03-03 修回日期:1998-06-25 发布日期:1998-12-15
  • 通讯作者: 张启运

Phase Diagram of Sn-In-Zn System and its Use for Lead-free Solder

Zheng Yu-Jun, Zhang Qi-Yun   

  1. Chemistry Department,Peking University,Beijing 100871
  • Received:1998-03-03 Revised:1998-06-25 Published:1998-12-15
  • Contact: Zhang Qi-Yun

摘要:

 Sn-In-Zn三元体系的液相限相图进行了实验和探讨,发现体系存在一个三元低共熔点E:46Sn-52ln-2Zn(100ω),其熔点为108℃.在相图研究的基础上,得出该体系作为无铅焊料的最佳组分为6.7Zn-8.0In-85.3Sn(100ω),其熔化温度为188℃.

关键词: Sn-In-Zn, 三元系相图, 无铅钎料

Abstract:

The liquidus of Sn-In-Zn system was determined by means of DTA technique. It was proved that the system has a ternary eutectic point at 108℃ containing Sn:46, In:52, Zn:2(100w). Based on the phase diagram and the DTA results. the optimum component of Sn-In-Zn alloy used for lead-free solder is recommended as(6.7Zn--8.0In-85.3Sn) with a melting temperature of 188℃.

Key words: Sn-In-Zn, Ternary phase diagram, Lead-free solder