物理化学学报 >> 1999, Vol. 15 >> Issue (11): 961-965.doi: 10.3866/PKU.WHXB19991101

通讯    下一篇

金纳米粒子通过形成Au-S键的组装

胡瑞省, 刘善堂, 朱涛, 刘忠范, 黄小华, 黄惠忠   

  1. 北京大学化学学院,纳米科技中心,北京 100871|北京大学化学学院,物理化学研究所,北京 100871
  • 收稿日期:1999-06-25 修回日期:1999-07-22 发布日期:1999-11-15
  • 通讯作者: 朱涛

Covalent Attachment of Gold Nanoparticles onto the Thiol-terminated Surface through Au-S Bonding

Hu Rui-Sheng, Liu Shan-Tang, Zhu Tao, Liu Zhong-Fan, Huang Xiao-Hua, Huang Hui-Zhong   

  1. Center for Nanoscale Science and Technology(CNST),College of Chemistry Molecular Engineering,Peking University,Beijing 100871|Institute of Physical Chemistry,College of Chemistry Molecular Engineering,Peking University,Beijing 100871
  • Received:1999-06-25 Revised:1999-07-22 Published:1999-11-15
  • Contact: Zhu Tao

关键词: 金纳米粒子, Au-S键, 组装

Abstract:

Gold nanoparticles were covalently attached to the thiol-terminated surface, which was created by aqueous silanization of the single crystal silicon substrate with 3-mercaptopropyl-trimethyl-silane(3-MPTMS). This paper reports the first evidence for Au-S bonding between the gold particles and the surface thiol-groups given by the angle resolved XPS measurements.

Key words: Gole nanoparticles, Au-S bonding, Assembly