物理化学学报 >> 2000, Vol. 16 >> Issue (11): 1022-1027.doi: 10.3866/PKU.WHXB20001111

研究论文 上一篇    下一篇

镍钨磷合金电结晶机理及其镀层结构与显微硬度

杨防祖, 牛振江, 曹刚敏, 许书楷, 周绍民   

  1. 厦门大学化学系,固体表面物理化学国家重点实验室,物理化学研究所 厦门 361005
  • 收稿日期:2000-02-28 修回日期:2000-06-19 发布日期:2000-11-15
  • 通讯作者: 杨防祖 E-mail:smzhou@xmu.edu.cn

Electrocrystallization Mechanism、Structure and Microhardnedss of Ni-W-P Alloy Eletrodeposits

Yang Fang-Zu, Niu Zhen-Jiang, Cao Gang-Min, Xu Shu-Kai, Zhou Shao-Min   

  1. Chemistry Department,State Key Laboratory for the Physical Chemistry of the Solid Surface,Institute of Physical Chemistry,Xiamen Univ,Xiamen 361005
  • Received:2000-02-28 Revised:2000-06-19 Published:2000-11-15
  • Contact: Yang Fang-Zu E-mail:smzhou@xmu.edu.cn

摘要:

应用循环伏安、恒电位阶跃和 X射线衍射( XRD)等方法研究了 Ni-W-P合金电沉积特点和镀层结构与显微硬度 .结果表明,在以柠檬酸铵为配体的溶液中, Ni-W-P合金沉积层较 Ni-W合金有较低的电化学活性 .根据电位阶跃的 i~ t曲线分析表明,在玻碳电极上 Ni-W-P合金电结晶过程遵从扩散控制瞬时成核三维成长模式进行,随着过电位的增加,电极表面上晶核数增多 . XRD试验结果表明, Ni-W-P合金镀层呈现明显的非晶态特征 .所获得的 Ni-W-P合金电沉积层的显微硬度在 450 kg• mm- 2左右 .

关键词: Ni-W-P合金, 电结晶, 结构, 显微硬度

Abstract:

The electrodeposition characteristics, structure and microhardness of Ni-W-P alloy have been studied by the methods of cyclic voltammetry, potentiostatic step and X-ray diffraction(XRD). The results showed that Ni-W-P alloy electrodeposit obtained from the solution containing ammonium citrate as complexing agent presented lower electrochemical activity compared with Ni-W alloy electrodeposit. Based upon the i~t curves of potentiostatic step, it was revealed that electrocrystallization of Ni-W-P alloy on glassy carbon electrode followed the mechanism of instantaneous nucleation and three dimensional growth with diffusion controll. The crystal nucleus number on the surface of electrode was raised by the increase of overpotential. XRD experimental results showed that the Ni-W-P alloy electrodeposits obtained were obviously of the amorphous structure, and the microhardness of the alloy was about 450 kg/mm2 at the stated plating solution and conditions.

Key words: Ni-W-P alloy, Electrocrystallization, Structure, Microhardness