物理化学学报 >> 2001, Vol. 17 >> Issue (05): 453-456.doi: 10.3866/PKU.WHXB20010515

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固-液金属界面上金属间化合物的非平衡生长

劳邦盛;高苏;张启运   

  1. 北京大学化学系,北京 100871
  • 收稿日期:2000-09-12 修回日期:2000-11-16 发布日期:2001-05-15
  • 通讯作者: 高苏 E-mail:Gaosu@chemms.pku.edu.cn

Nonequilibrium Growth of Intermetallics at the Interface of Liquidsolid Metal

Lao Bang-Sheng;Gao Su;Zang Qi-Yun   

  1. Department of Chemistry, Peking University, Beijing 100871
  • Received:2000-09-12 Revised:2000-11-16 Published:2001-05-15
  • Contact: Gao Su E-mail:Gaosu@chemms.pku.edu.cn

关键词: 金属间化合物, 界面反应, 钎焊

Abstract: The growth characteristic of intermetallics during the reaction of solid (Cu,Ag,Au,Fe,Co,Ni,etc) with liquid (Sn,Sb,Bi,Zn) within a very short time of 1~2 s at different temperatures has been studied by metallographic method for explaining the process in the fillet during soldering. It is indicated that the incongruent compourds often grow up as bamboo shoot form. But congruent compounds grow up basically just by spreading out as a layer along the solid border. Base on these facts,the influence of intermetallics in the fillet during soldering has been discussed.

Key words: Intermetallics, Interface reaction, Soldering