物理化学学报 >> 2005, Vol. 21 >> Issue (05): 463-467.doi: 10.3866/PKU.WHXB20050501

研究论文    下一篇

电位活化现象与金属电沉积初始过程的研究

冯绍彬; 商士波; 包祥; 冯丽婷; 张经纬; 李宗慧   

  1. 郑州轻工业学院材料与化学工程学院，郑州 450002； 河南大学特种功能材料重点实验室，开封 475001
  • 收稿日期:2004-09-14 修回日期:2004-10-18 发布日期:2005-05-15
  • 通讯作者: 冯绍彬 E-mail:fengshaobin@21cn.com

Study of Potential Activation Phenomenon and Initial Process of the Metal Electrodeposition

FENG Shao-bin; SHANG Shi-bo; BAO Xiang; FENG Li-ting; ZHANG Jing-wei; LI Zong-hui   

  1. College of Material and Chemistry Engineering, Zhengzhou Institute of Light Industry, Zhengzhou 450002; Special Functional Material Laboratory, Henan University, Kaifeng 475001
  • Received:2004-09-14 Revised:2004-10-18 Published:2005-05-15
  • Contact: FENG Shao-bin E-mail:fengshaobin@21cn.com

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摘要： 进行了恒电流电位-时间曲线和循环伏安曲线的测定，显示了铁电极进行氰化物镀铜时，镀层沉积前铁表面的电位活化过程. 对铁电极上焦磷酸盐镀铜的初始过程研究表明，由于铜的析出电位较正，铜是在未活化的电极表面上沉积的，因此镀层的结合强度很差.采用氩离子溅射和X射线光电子能谱相结合的方法，检测焦磷酸盐镀铜层和铁基体界面区含氧量的变化，证明了氧化层的存在. 通过添加辅助络合剂和控制起始电流密度的方法，可以增强无氰电镀时阴极的极化. 当铜的析出电位负于铁基体的活化电位时，可显示出铁表面的电位活化过程，定量测量镀层的结合强度也与氰化物电镀相近.

关键词: 电沉积, 初始过程, 电位活化, 结合强度, 深度刻蚀, X射线光电子能谱

Abstract: The potential-time curves under constant current and cyclic voltammetry curves were measured, and the potential activation process of copper plating on iron substrate in cyanide electrolyte was shown. The initial process of pyrophosphate copper plating on the iron electrode was studied. The results show that deposition potential of copper is positive and copper deposits on the inactive surface of electrode. The bond intensity of plating layer is very bad. By using Ar ion sputtering and X-ray photoelectron spectroscopy, the oxygen contents between the copper plating layer and iron substrate were examined and the existence of oxygen layer was proved. Through adding assistant complexing agent and controlling initial current density, cathodic polarization was intensified in cyanide-free electrolyte. When the deposition potential of copper is less than activation potential of the iron substrate, the potential activation process was shown. The bond intensity of the plating layer is close to that of cyanide copper plating.

Key words: Electrodeposition, Initial process, Potential activation, Bond intensity, Depth profiling, X-ray photoelectron spectra