物理化学学报 >> 2009, Vol. 25 >> Issue (01): 86-90.doi: 10.3866/PKU.WHXB20090115

研究论文 上一篇    下一篇

3-氨基-1,2,4-三氮唑对铜的缓蚀性能和吸附行为

徐群杰; 李春香; 周国定; 朱律均; 林昌健   

  1. 上海电力学院环境工程系, 上海 200090; 上海大学应用化学系, 上海 200444; 厦门大学固体表面物理化学国家重点实验室, 福建 厦门 361005
  • 收稿日期:2008-07-04 修回日期:2008-09-19 发布日期:2008-12-31
  • 通讯作者: 徐群杰 E-mail:xuqunjie@shiep.edu.cn

Copper Corrosion Inhibition and Adsorption Behavior of 3-Amino-1,2,4-triazole

XU Qun-Jie; LI Chun-Xiang; ZHOU Guo-Ding; ZHU Lv-Jun; LIN Chang-Jian   

  1. Department of Environment Engieering, Shanghai University of Electric Power, Shanghai 200090, P. R. China; Department of Chemical Engineering, Shanghai University, Shanghai 200444, P. R. China; 3State Key Laboratory of Solid Surface Physical Chemistry, Xiamen University, Xiamen 361005, Fujian Province, P. R. China
  • Received:2008-07-04 Revised:2008-09-19 Published:2008-12-31
  • Contact: XU Qun-Jie E-mail:xuqunjie@shiep.edu.cn

摘要: 采用电化学和表面增强拉曼光谱(SERS)方法研究了新型环境友好型金属水处理剂3-氨基-1,2,4-三氮唑(ATA)对铜在3% NaCl溶液中的缓蚀性能和吸附行为. 结果表明, ATA对铜有较好的缓蚀作用, 其中ATA浓度为0.24 mmol·L-1时对铜的缓蚀效率最高, 为97.65%, 其吸附行为符合Langmuir吸附等温式, 吸附机理是典型的化学吸附援SERS表明, ATA分子通过很强的吸附于铜表面达到抑制其腐蚀的作用, 是ATA-与Cu+形成配合物来阻止氯离子化合物(CuCl-2)的生成.

关键词: 铜, ATA, 缓蚀剂电化学, SERS

Abstract: Corrosion inhibition of copper in 3%NaCl solution by 3-amino-1,2,4-triazole (ATA) was studied in relation to the concentration of the inhibitor using electrochemical (ac impedance and dc polarization) and surface enhanced Raman spectroscopy (SERS) techniques. The results indicated that ATAwas a good corrosion inhibiter for copper in a 3% NaCl solution. The inhibition efficiency was 97.65% at an ATA concentration of 20 mg·L -1. Polarization curves showed that ATA behaved as a type of cathodical inhibitor in 3% NaCl solution. Adsorption of ATA followed Langmuir’s adsorption isotherm and the adsorption mechanism was typical of chemisorption. SERS revealed that inhibition of copper corrosion was due to adsorption of ATA molecules on the surface of copper. SERS also confirmed that the adsorbed ATA molecules formed a complex with Cu+ which prevented the formation of copper chloride complexes, CuCl-2.

Key words: Copper, ATA, Inhibitor, Electrochemistry, SERS

MSC2000: 

  • O646