物理化学学报 >> 2013, Vol. 29 >> Issue (12): 2579-2584.doi: 10.3866/PKU.WHXB201310092

电化学和新能源 上一篇    下一篇

铜电极表面铜锡合金电结晶机理

史纪鹏, 杨防祖, 田中群, 周绍民   

  1. 厦门大学化学化工学院, 固体表面物理化学国家重点实验室, 福建 厦门 361005
  • 收稿日期:2013-07-30 修回日期:2013-10-07 发布日期:2013-11-28
  • 通讯作者: 杨防祖 E-mail:fzyang@xmu.edu.cn
  • 基金资助:

    国家自然科学基金(21021002)及国家重点基础研究发展计划(973) (2009CB930703)资助项目

Electrocrystallization of Cu-Sn Alloy on Copper Electrode Surface

SHI Ji-Peng, YANG Fang-Zu, TIAN Zhong-Qun, ZHOU Shao-Min   

  1. State Key Laboratory of Physical Chemistry of Solid Surfaces, College of Chemistry and Chemical Engineering, Xiamen University, Xiamen 361005, Fujian Province, P. R. China
  • Received:2013-07-30 Revised:2013-10-07 Published:2013-11-28
  • Contact: YANG Fang-Zu E-mail:fzyang@xmu.edu.cn
  • Supported by:

    The project was supported by the National Natural Science Foundation of China (21021002) and National Key Basic Research Program of China (973) (2009CB930703).

摘要:

在弱酸性柠檬酸盐体系铜锡合金镀液中, 采用线性扫描伏安(LSV)、循环伏安(CV)和计时安培实验方法, 运用Scharifker-Hills (SH)理论模型和Heerman-Tarallo (HT)理论模型分析拟合实验结果, 研究铜锡合金在铜电极上的电沉积过程与电结晶机理. 结果表明, 铜锡合金在铜电极表面实现共沉积并遵循扩散控制下三维瞬时成核的电结晶过程. 电位阶跃从-0.80 V负移至-0.85 V (vs SCE), HT理论分析得到铜锡合金的成核与生长的动力学参数分别为成核速率常数(A)值从20.19 s-1增加至177.67 s-1, 成核活性位点密度数(N0)从6.10×105 cm-2提高至1.42×106 cm-2, 扩散系数(D)为(6.13±0.62)×10-6 cm2·s-1.

关键词: 铜锡合金, 电结晶, 循环伏安, 计时安培曲线

Abstract:

The co-deposition and electrocrystallization of Cu-Sn alloy in a weak acidic citrate bath were studied by linear sweep voltammetry (LSV), cyclic voltammetry (CV), and chronoamperometry. The Scharifker- Hill (SH) theory model and Heerman-Tarallo (HT) theory model were applied to analyze the chronoamperometry data. The results show that the Cu-Sn alloy co-deposited on copper electrode, following instantaneous nucleation with three-dimensional (3D) growth under diffusion control. The kinetic parameters were obtained using the HT model. As the step potential shifted from -0.80 to -0.85 V, the nucleation rate constant (A) increased from 20.19 to 177.67 s-1, the density of active nucleation sites (N0) increased from 6.10×105 to 1.42×106 cm-2, and the diffusion coefficient (D) was (6.13±0.62)×10-6 cm2·s-1.

Key words: Cu-Sn alloy, Electrocrystallization, Cyclic voltammetry, Chronoamperometry

MSC2000: 

  • O646