物理化学学报 >> 2011, Vol. 27 >> Issue (09): 2135-2140.doi: 10.3866/PKU.WHXB20110935

电化学和新能源 上一篇    下一篇

铜电化学沉积在微孔金属化中的应用

杨防祖, 吴伟刚, 田中群, 周绍民   

  1. 厦门大学化学化工学院, 固体表面物理化学国家重点实验室, 福建厦门 361005
  • 收稿日期:2011-05-27 修回日期:2011-07-06 发布日期:2011-08-26
  • 通讯作者: 杨防祖 E-mail:fzyang@xmu.edu.cn
  • 基金资助:

    国家自然科学基金(20873114, 20833005, 21021002)和国家重点基础研究发展规划项目(973) (2009CB930703)资助

Application of Copper Electrochemical Deposition for the Metallization of Micropores

YANG Fang-Zu, WU Wei-Gang, TIAN Zhong-Qun, ZHOU Shao-Min   

  1. College of Chemistry and Chemical Engineering, State Key Laboratory of Physical Chemistry of the Solid Surfaces, Xiamen University, Xiamen 361005, Fujian Province, P. R. China
  • Received:2011-05-27 Revised:2011-07-06 Published:2011-08-26
  • Contact: YANG Fang-Zu E-mail:fzyang@xmu.edu.cn
  • Supported by:

    The project was supported by the National Natural Science Foundation of China (20873114, 20833005, 21021002) and National Key Basic Research Program of China (973) (2009CB930703).

摘要: 以分布有微孔的印刷线路板(PCB)作为模板, 按照PCB孔金属化工艺路线, 研究乙醛酸化学镀铜和柠檬酸盐体系铜电沉积工艺在PCB微孔金属化中的应用. 结果表明, 乙醛酸化学镀铜和柠檬酸盐体系电沉积铜可以成功地应用于PCB微孔金属化加工工艺中. 微孔化学镀铜金属化导电处理后, 铜附着于微孔内壁, 颗粒细小, 但排列疏松且局部区域发生漏镀现象. 微孔一经电镀铜加厚, 镀层电阻显著下降; 孔壁内外的铜沉积速率达到0.8:1.0; 铜颗粒具有一定的侧向生长能力, 能够完全覆盖化学镀铜时产生的微小漏镀区域; 微孔内壁铜镀层连续、结构致密并紧密附着于内壁, 大大增强了PCB上下层互连的导电性能.

关键词: 微孔, 化学镀铜, 电沉积铜, 金属化, 印刷线路板

Abstract: According to established routes for the microporous metallization of printed circuit boards (PCB), electroless copper plating using glyoxylic acid as a reducing agent and copper electroplating in a citrate bath were used for microporous metallization with PCB distributing micropores as a template. The results show that electroless copper plating using glyoxylic acid as a reducing agent and copper electroplating in a citrate bath can be successfully applied to the microporous metallization of PCB. After an electric conducting treatment of the micropores by electroless copper plating the copper deposited as fine grains and attached to the inner walls of the micropores. The copper deposit was also found in the loose grain arrangement and the leak plating area. Immediately after thickening treatment by copper electroplating, the resistance toward the copper coating of the inner wall decreased notably. The ratio of the copper electroplating rates at the inner and outer micropores was found to be 0.8:1.0. The copper electrodeposit fully covered the surface of the inner wall including the leak plating area, which means that the electroplated copper grains have a certain sideway growing ability. The copper coating on the inner wall was continuous, compact, and adhesive. This coating highly enhanced the conductivity of the interconnected PCB.

Key words: Micropore, Electroless copper plating, Copper electroplating, Metallization, Printed circuit board

MSC2000: 

  • O646