物理化学学报 >> 2001, Vol. 17 >> Issue (02): 150-154.doi: 10.3866/PKU.WHXB20010212

研究论文 上一篇    下一篇

退火前后镍钨硼合金电沉积层的结构与性能

曹刚敏;杨防祖;黄令;牛振江;许书楷;周绍民   

  1. 厦门大学化学系 固体表面物理化学国家重点实验室 物理化学研究所,厦门 361005
  • 收稿日期:2000-05-08 修回日期:2000-09-05 发布日期:2001-02-15
  • 通讯作者: 杨防祖 E-mail:smzhou@xmu.edu.cn

Structure and Property of Ni-W-B Alloy Electrodeposits Before and After Heat Treatment

Cao Gang-Min;Yang Fang-Zu;Huang Ling;Niu Zhen-Jiang;Xu Shu-Kai;Zhou Shao-Min   

  1. Chemistry Department, State Key Laboratory for Physical Chemistry of Solid Surfaces, Institute of Physical Chemistry, Xiamen University,Xiamen 361005
  • Received:2000-05-08 Revised:2000-09-05 Published:2001-02-15
  • Contact: Yang Fang-Zu E-mail:smzhou@xmu.edu.cn

摘要: 采用电化学技术、XPS、DSC、XRD等方法研究NiWB合金电沉积及热处理前后合金镀层的结构和显微硬度.结果表明,在NiWB合金电沉积过程中伴随着化学沉积镍等过程以及Na2B4O7在镀层中的夹杂;NiW和NiWB合金电沉积层分别表现为纳米晶结构和非晶态结构;热处理过程中合金电沉积层发生晶粒粗化过程以及NiWB合金镀层发生新相形成过程,产生Ni4W和镍硼化物如Ni2B、Ni3B等沉淀物;400 ℃热处理2 h后NiW合金镀层有最大的显微硬度达919.8 kg•mm-2,而在500 ℃下NiWB合金有最大的硬度达1132.2 kg•mm-2.

关键词: Ni-W-B合金, 电沉积, 结构, 显微硬度, 热处理

Abstract: The structure and microhardness of NiWB alloy were studied by means of electrochemical techniques, XPS, DSC and XRD before and after heat treatment. The results showed that the process of NiWB alloy electrodeposition was accompanied by the chemical deposition of Ni and adulteration of Na2B4O7 in the deposit. NiW alloy presented in nanocrystalline structure and NiWB in amorphous structure were both coarsened in grain size and led to the evolution of Ni4W, and precipitation of Ni-B compound such as Ni2B, Ni3B in NiWB alloy after heat treatment. The maximum microhardness could be observed for NiW alloy at the value of 919.8 kg•mm-2 after heat treatment for 2 hours at temperature of 400 ℃ and NiWB alloy at 1132.2 kg•mm-2 (500 ℃, 2 hrs).

Key words: Ni-W-B alloy, Electrodeposition, Structure, Microhardness, Heat treatment