物理化学学报 >> 2009, Vol. 25 >> Issue (11): 2391-2394.doi: 10.3866/PKU.WHXB20091124

研究论文 上一篇    下一篇

以Au和Au-Cu为衬底的Si/DLC薄膜的机械性能

屈少华, 贾丽慧   

  1. 襄樊学院物理系, 湖北 襄樊 441053|武汉工程大学化工与制药学院, 湖北省新型反应器与绿色化学工艺重点实验室, 武汉 430074
  • 收稿日期:2009-05-25 修回日期:2009-08-16 发布日期:2009-10-28
  • 通讯作者: 贾丽慧 E-mail:jialihui715@gmail.com

Mechanical Properties of Si/DLC Films on Au and Au-Cu Substrates

QU Shao-Hua, JIA Li-Hui   

  1. Department of Physics, Xiangfan University, Xiangfan 441053, Hubei Province, P. R. China|School of Chemical Engineering and Pharmacy, Wuhan Institute of Technology, Hubei Key Laboratory of Novel Reactor &|Green Chemical Technology, Wuhan 430074, P. R. China
  • Received:2009-05-25 Revised:2009-08-16 Published:2009-10-28
  • Contact: JIA Li-Hui E-mail:jialihui715@gmail.com

摘要:

通过纳米划痕测试技术(nano-scratch)研究了以Au和Au-Cu(xAu=93%, xCu=7%)为衬底, 多晶硅Si为基片的类金刚石(DLC)薄膜的机械性能, 其中DLC薄膜厚度约为10 nm. 研究结果表明, Au-Cu衬底对Si/DLC薄膜的结合力比Au衬底对Si/DLC薄膜的结合力要好. 紫外(244 nm)为激发光源的拉曼光谱测试结果显示在相同薄膜制备条件下Au-Cu衬底比Au衬底含有更多的sp3成分, 同时也意味着以Au-Cu为衬底的Si/DLC薄膜具有更高的硬度和密度. 通过对研究结果的分析讨论可以得出, 由于具有较好的结合力和高硬度, Au-Cu是磁记录磁头保护膜Si/DLC薄膜的更好lead材料.

关键词: 拉曼光谱, 类金刚石薄膜, 结合力, 硬度

Abstract:

The mechanical properties of Si/DLC (diamond-like carbon, around 10 nm) films on Au and Au-Cu (xAu=93%, xCu=7%) substrates were studied by nanoscratch tests. Results show that Au-Cu exhibits better adhesion to Si/DLC than Au does to Si/DLC. Ultraviolet (244 nm) Raman spectra show that DLC films on Au-Cu contain more sp3 character than those on Au using the same batch coating process. This indicates greater hardness and higher density of the films on Au-Cu. The implications of these results on the mechanisms proposed for film formation are discussed. Au-Cu is thus a better candidate for use as a lead material in Si/DLC coatings because of its better adhesion and greater hardness for magnetic recording sliders.

Key words: Raman spectroscopy, Diamond-like carbon film, Adhesion, Hardness

MSC2000: 

  • O647