物理化学学报 >> 2012, Vol. 28 >> Issue (03): 711-719.doi: 10.3866/PKU.WHXB201112213

材料物理化学 上一篇    下一篇

原位法制备纳米银修饰碳纳米管环氧导电复合材料

刘孔华, 刘岚, 高宏, 罗远芳, 贾德民   

  1. 华南理工大学材料科学与工程学院, 广州 510640
  • 收稿日期:2011-10-31 修回日期:2011-12-08 发布日期:2012-02-23
  • 通讯作者: 刘岚 E-mail:psliulan@scut.edu.cn
  • 基金资助:

    国家自然科学基金(50608034, 50873036), 广东高校科技创新重点项目(CXZD1106)和华南理工大学中央高校基本科研业务费(2012ZZ0006)资助项目

In situ Preparation of Epoxy-Based Conductive Nanocomposites Containing Nanosilver-Decorated Carbon Nanotubes

LIU Kong-Hua, LIU Lan, GAO Hong, LUO Yuan-Fang, JIA De-Min   

  1. College of Material Science and Engineering, South China University of Technology, Guangzhou 510640, P. R. China
  • Received:2011-10-31 Revised:2011-12-08 Published:2012-02-23
  • Contact: LIU Lan E-mail:psliulan@scut.edu.cn
  • Supported by:

    The project was supported by the National Natural Science Foundation of China (50608034, 50873036), Science and Technology Innovation Key Project of Universities of Guangdong Province, China (CXZD1106), and Fundamental Research Funds for the Central Universities, South China University of Technology, China (2012ZZ0006).

摘要: 将碳纳米管(CNTs)和乙酸银同时引入到环氧树脂-咪唑固化体系中, 在固化过程中原位热降解银-咪唑复合物生成纳米银修饰碳纳米管, 差示扫描量热仪(DSC)表明改性碳纳米管对环氧固化有一定的促进作用. 采用X-射线衍射(XRD)表征了乙酸银和咪唑配合物[Ag(2E4MZ)2]Ac 的结构, 并提出了原位降解生成纳米银的机理. XRD结果表明, 单独的乙酸银-咪唑配合物热降解生成的纳米银粒径为21-24 nm, 而配合物在环氧基体中生成的纳米银粒径为11-13 nm. 添加80%(质量分数)片状微米银粉制备的纳米银/碳纳米管环氧导电复合材料其体积电阻率低达9×10-5 Ω·cm. 当纳米银和碳纳米管质量比为80:20 时, 复合材料导电性和剪切强度达到最佳; 采用扫描电镜(SEM)表征了复合材料的形貌结构.

关键词: 低温烧结, 纳米复合材料, 接触电阻, 导电填料, 体积电阻率

Abstract: Nanosilver-decorated carbon nanotubes (CNTs) were prepared by introducing CNTs and silver acetate into an epoxy-imidazole curing system and simultaneous in situ thermal degradation of an Ag-imidazole complex. Differential scanning calorimetry (DSC) results indicated that modified CNTs played a certain role in promoting the curing of the epoxy. The structure of the silver acetate-imidazole complex was characterized by X-ray diffraction (XRD). The size of the nano-silver particles resulting from degradation of the Ag-imidzole complex was between 21 and 24 nm, and between 11 and 13 nm when the Ag-imidzole complex was added to the epoxy matrix. When silver flakes with a mass fraction of 80% was added to the composites, the volume resistivity of the nanosilver-decorated CNTs/epoxy conductive composite was as low as 9×10-5 Ω·cm. The optimum conductivity and shear strength were achieved when the ratio of nanosilver and CNTs was 80:20 (mass ratio). Scanning electron microscopy (SEM) revealed the structural morphology of the composite.

Key words: Low temperature sintering, Nanocomposite, Contact resistance, Conductive filler, Volume resistivity

MSC2000: 

  • O641.08