Acta Phys. -Chim. Sin. ›› 1997, Vol. 13 ›› Issue (09): 848-852.doi: 10.3866/PKU.WHXB19970915

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Cure Kinetics of Epoxy Resin System Toughened by Polyhexamethylene Carbonate Diol

Chen Tong-Hui,Bai Yao-Wen,Sun Ren-Hui   

  1. Department of Applied Chemistry,Tianjin University,Tianjin 300072
  • Received:1996-12-04 Revised:1997-04-14 Published:1997-09-15
  • Contact: Chen Tong-Hui

Abstract:

The kinetics of the cure reaction for the system consisting of bisphenol-A diglycidyl ether, No.70 anhydride, Polyhexamethylene Carbonate Diol(PHMCD) and DMP-30 has been studied. By use of differential scanning calorimetry(DSC) under isothermal condition, the reaction is found to proceed first via autocatalytic mechanism up to a conversion of 0.3 and then become a first order reaction over a temperature range of 130~160 ℃. The kinetic parameters of the curing reaction have also been determined with both E1 = 63.74 kJ.mol-1, lnA1=13, lnA2 = -3for the autocatalytic mechanism and E =64.68 kJ•mol-1, lnA = 13.8 for the first order mechanism.

Key words: DSC, Epoxy resin, Curing kinetics, Toughen, Polyhexamethylene carbonate diol(PHMCD)