Acta Phys. -Chim. Sin. ›› 2000, Vol. 16 ›› Issue (04): 366-369.doi: 10.3866/PKU.WHXB20000414

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Plating Structure and Antioxygention of Micron Cu-Ag Bimetallic Powder

Gao Bai-Jiao, Gao Jian-Feng, Jiang Hong-Mei, Zhang Zhong-Xing   

  1. Department of Chemical Engineering,North China Institute of Technology,Taiyuan 030051
  • Received:1999-06-08 Revised:1999-10-03 Published:2000-04-15
  • Contact: Gao Bai-Jiao


The correlation of plating structure with the antioxygenation of micro Cu-Ag bimetallic powder was studied by SEM、XRD、TG and other means. It was found that copper powder plated with silver having an interspersion structure posesses antioxygenation at normal atmospheric temperature as surface Ag content reaches above 15.22%, the temperature of oxidation resistance varies with the surface Ag content. The greater the surface Ag content is, the higher the temperature of antioxygenation for bimetalic powder with the plating interspersion structure. The copper powder plated by silver with full packaging structure can not be oxidized even at 700℃.

Key words: Cu-Ag bimetallic powder, Surface structure, Oxidation resistence