Acta Phys. -Chim. Sin. ›› 2009, Vol. 25 ›› Issue (11): 2391-2394.doi: 10.3866/PKU.WHXB20091124

• ARTICLE • Previous Articles     Next Articles

Mechanical Properties of Si/DLC Films on Au and Au-Cu Substrates

QU Shao-Hua, JIA Li-Hui   

  1. Department of Physics, Xiangfan University, Xiangfan 441053, Hubei Province, P. R. China|School of Chemical Engineering and Pharmacy, Wuhan Institute of Technology, Hubei Key Laboratory of Novel Reactor &|Green Chemical Technology, Wuhan 430074, P. R. China
  • Received:2009-05-25 Revised:2009-08-16 Published:2009-10-28
  • Contact: JIA Li-Hui E-mail:jialihui715@gmail.com

Abstract:

The mechanical properties of Si/DLC (diamond-like carbon, around 10 nm) films on Au and Au-Cu (xAu=93%, xCu=7%) substrates were studied by nanoscratch tests. Results show that Au-Cu exhibits better adhesion to Si/DLC than Au does to Si/DLC. Ultraviolet (244 nm) Raman spectra show that DLC films on Au-Cu contain more sp3 character than those on Au using the same batch coating process. This indicates greater hardness and higher density of the films on Au-Cu. The implications of these results on the mechanisms proposed for film formation are discussed. Au-Cu is thus a better candidate for use as a lead material in Si/DLC coatings because of its better adhesion and greater hardness for magnetic recording sliders.

Key words: Raman spectroscopy, Diamond-like carbon film, Adhesion, Hardness

MSC2000: 

  • O647