Acta Phys. -Chim. Sin. ›› 2010, Vol. 26 ›› Issue (10): 2647-2652.doi: 10.3866/PKU.WHXB20100940

• ELECTROCHEMISTRY • Previous Articles     Next Articles

Electropolymerization of Nickel Complexes with Schiff Bases: Effect of Sweep Rate on Anodic Polymerization

LI Jian-Ling, GAO Fei, ZHANG Ya-Kun, HE Li-Zhi, HAN Gui-Mei, WANG Xin-Dong   

  1. Department of Physical Chemistry, University of Science and Technology Beijing, Beijing 100083, P. R. China
  • Received:2010-05-04 Revised:2010-06-12 Published:2010-09-27
  • Contact: LI Jian-Ling
  • Supported by:

    The project was supported by the Natural Science Foundation of Beijing, China (2093039) and Programfor New Century Excellent Talents in University, China.


Anodic electrochemical polymerization of N,N'-ethylenbis (salicylideneaminato) nickel(II) ([Ni(salen)]) in tetrabutylammonium perchlorate (TBAP)/acetonitrile (AN) was investigated by the linear sweep potential method. The sweep rate ranged from 5 to 150 mV·s-1. The effect of sweep rate on the growth of poly[Ni(salen)] was studied by Coulomb analysis. The morphologies of poly[Ni(salen)] were characterized by field emission scanning electron microscopy (FESEM). The relationship between the growth rate of poly[Ni(salen)] (dΓ/dm) and the sweep rate (v) fits the exponential degradation equation. The content of the redox center for poly[Ni(salen)], grown at sweep rate of 20 mV·s-1, reaches a maximum and then decreases as the sweep rate increases because monomer diffusion restricts the growth of poly[Ni(salen)]. We studied the effect of polymerization sweep rate on the kinetics of the as-grown poly[Ni (salen)] by cyclic voltammetry. The charge diffusion coefficient (D) of poly[Ni(salen)] grown at a sweep rate of 20 mV·s-1 was found to be the highest.

Key words: Electropolymerization, Schiff base, Transition metal complex, Doping level, Charge diffusioncoefficient


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