Acta Phys. -Chim. Sin. ›› 2010, Vol. 26 ›› Issue (10): 2625-2632.doi: 10.3866/PKU.WHXB20101002

• ELECTROCHEMISTRY • Previous Articles     Next Articles

Electrodeposition of Copper in a Citrate Bath and Its Application to a Micro-Electro-Mechanical System

WU Wei-Gang1, YANG Fang-Zu1, LUO Ming-Hui2, TIAN Zhong-Qun1, ZHOU Shao-Min1   

  1. 1. College of Chemistry and Chemical Engineering, State Key Laboratory of Physical Chemistry of Solid Surfaces, Xiamen University, Xiamen 361005, Fujian Province, P. R. China;
    2. School of Physics and Mechanical & Electrical Engineering, Xiamen University, Xiamen 361005, Fujian Province, P. R. China
  • Received:2010-03-20 Revised:2010-07-22 Published:2010-09-27
  • Contact: YANG Fang-Zu E-mail:fzyang@xmu.edu.cn
  • Supported by:

    The project was supported by the National Natural Science Foundation of China (20873114, 20833005) and National Key Basic Research Programof China (973) (2009CB930703).

Abstract:

We investigated the effect of plating parameters on the coating morphology and grain size of copper using a novel citrate bath. The structure and deposit were characterized by X-ray diffraction (XRD) and X-ray photoelectron spectroscopy (XPS), respectively. The copper plating bath was applied to a micro-electro-mechanical system (MEMS). Results show that an even and compact copper coating was obtained for the fine grains using plating parameters of 6g·L-1 Cu2+, pH=7.0-8.5, 1-2A·dm-2, 45 ℃, and bath agitation. The deposit consists of pure copper in a fcc polycrystalline structure.A planar inductor was successfully fabricated by MEMS using this bath and its maximum quality factor was 12.75, which satisfies the design requirements.

Key words: Electrodeposition, Citrate, Copper, Deposit characterization, Planar inductor, Micro -electro -mechanical system

MSC2000: 

  • O646