Acta Phys. -Chim. Sin. ›› 2010, Vol. 26 ›› Issue (10): 2625-2632.doi: 10.3866/PKU.WHXB20101002

• ELECTROCHEMISTRY • Previous Articles     Next Articles

Electrodeposition of Copper in a Citrate Bath and Its Application to a Micro-Electro-Mechanical System

WU Wei-Gang1, YANG Fang-Zu1, LUO Ming-Hui2, TIAN Zhong-Qun1, ZHOU Shao-Min1   

  1. 1. College of Chemistry and Chemical Engineering, State Key Laboratory of Physical Chemistry of Solid Surfaces, Xiamen University, Xiamen 361005, Fujian Province, P. R. China;
    2. School of Physics and Mechanical & Electrical Engineering, Xiamen University, Xiamen 361005, Fujian Province, P. R. China
  • Received:2010-03-20 Revised:2010-07-22 Published:2010-09-27
  • Contact: YANG Fang-Zu
  • Supported by:

    The project was supported by the National Natural Science Foundation of China (20873114, 20833005) and National Key Basic Research Programof China (973) (2009CB930703).


We investigated the effect of plating parameters on the coating morphology and grain size of copper using a novel citrate bath. The structure and deposit were characterized by X-ray diffraction (XRD) and X-ray photoelectron spectroscopy (XPS), respectively. The copper plating bath was applied to a micro-electro-mechanical system (MEMS). Results show that an even and compact copper coating was obtained for the fine grains using plating parameters of 6g·L-1 Cu2+, pH=7.0-8.5, 1-2A·dm-2, 45 ℃, and bath agitation. The deposit consists of pure copper in a fcc polycrystalline structure.A planar inductor was successfully fabricated by MEMS using this bath and its maximum quality factor was 12.75, which satisfies the design requirements.

Key words: Electrodeposition, Citrate, Copper, Deposit characterization, Planar inductor, Micro -electro -mechanical system


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