Acta Phys. -Chim. Sin. ›› 2012, Vol. 28 ›› Issue (03): 711-719.doi: 10.3866/PKU.WHXB201112213

• PHYSICAL CHEMISTRY OF MATERIALS • Previous Articles     Next Articles

In situ Preparation of Epoxy-Based Conductive Nanocomposites Containing Nanosilver-Decorated Carbon Nanotubes

LIU Kong-Hua, LIU Lan, GAO Hong, LUO Yuan-Fang, JIA De-Min   

  1. College of Material Science and Engineering, South China University of Technology, Guangzhou 510640, P. R. China
  • Received:2011-10-31 Revised:2011-12-08 Published:2012-02-23
  • Contact: LIU Lan E-mail:psliulan@scut.edu.cn
  • Supported by:

    The project was supported by the National Natural Science Foundation of China (50608034, 50873036), Science and Technology Innovation Key Project of Universities of Guangdong Province, China (CXZD1106), and Fundamental Research Funds for the Central Universities, South China University of Technology, China (2012ZZ0006).

Abstract: Nanosilver-decorated carbon nanotubes (CNTs) were prepared by introducing CNTs and silver acetate into an epoxy-imidazole curing system and simultaneous in situ thermal degradation of an Ag-imidazole complex. Differential scanning calorimetry (DSC) results indicated that modified CNTs played a certain role in promoting the curing of the epoxy. The structure of the silver acetate-imidazole complex was characterized by X-ray diffraction (XRD). The size of the nano-silver particles resulting from degradation of the Ag-imidzole complex was between 21 and 24 nm, and between 11 and 13 nm when the Ag-imidzole complex was added to the epoxy matrix. When silver flakes with a mass fraction of 80% was added to the composites, the volume resistivity of the nanosilver-decorated CNTs/epoxy conductive composite was as low as 9×10-5 Ω·cm. The optimum conductivity and shear strength were achieved when the ratio of nanosilver and CNTs was 80:20 (mass ratio). Scanning electron microscopy (SEM) revealed the structural morphology of the composite.

Key words: Low temperature sintering, Nanocomposite, Contact resistance, Conductive filler, Volume resistivity

MSC2000: 

  • O641.08