Acta Phys. -Chim. Sin. ›› 2012, Vol. 28 ›› Issue (03): 693-698.doi: 10.3866/PKU.WHXB201201111

• CATALYSIS AND SURFACE SCIENCE • Previous Articles     Next Articles

Solution-Phase Synthesis of Superhydrophobic Copper Surface with Dual Scale Roughness

XU Fei-Yan, LIU Li-Jun, QIN Jian, LIU Bei, MEI Shuang   

  1. College of Chemistry and Chemical Engineering, Wuhan Textile University, Wuhan 430073, P. R. China
  • Received:2011-11-04 Revised:2011-12-31 Published:2012-02-23
  • Contact: LIU Li-Jun
  • Supported by:

    The project was supported by China National Textile and Apparel Council (2011054).

Abstract: A copper sulfide film with dual scale micro- and nano-structured roughness was constructed on copper foil via a facile solution-phase method using the sodium thiosulphate and cupric chloride as raw materials. The resulting film was characterized by X-ray diffraction (XRD), scanning electron microscopy (SEM), energy dispersive X-ray (EDX) spectrometer, and contact angle measurements. After stearic acid hydrophobization, the film exhibited a water contact angle of 161° and a sliding angle of 2.5° for a 5 μL water droplet. The superhydrophobicity was attributed to a combination of the dual scale roughness at the micro- and nano-meter levels and the low surface energy of the stearic acid coating. This is a simple synthetic methodology requiring no complex or harsh equipment. The copper surface obtained has the excellent non-sticking property, long-term storage stability, and relatively good anti-abrasion property.

Key words: Solution-phase synthesis, Superhydrophobicity, Copper, Stearic acid, Anti-abrasion


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