Acta Phys. -Chim. Sin. ›› 2005, Vol. 21 ›› Issue (05): 463-467.doi: 10.3866/PKU.WHXB20050501

• ARTICLE •     Next Articles

Study of Potential Activation Phenomenon and Initial Process of the Metal Electrodeposition

FENG Shao-bin; SHANG Shi-bo; BAO Xiang; FENG Li-ting; ZHANG Jing-wei; LI Zong-hui   

  1. College of Material and Chemistry Engineering, Zhengzhou Institute of Light Industry, Zhengzhou 450002; Special Functional Material Laboratory, Henan University, Kaifeng 475001
  • Received:2004-09-14 Revised:2004-10-18 Published:2005-05-15
  • Contact: FENG Shao-bin E-mail:fengshaobin@21cn.com

Abstract: The potential-time curves under constant current and cyclic voltammetry curves were measured, and the potential activation process of copper plating on iron substrate in cyanide electrolyte was shown. The initial process of pyrophosphate copper plating on the iron electrode was studied. The results show that deposition potential of copper is positive and copper deposits on the inactive surface of electrode. The bond intensity of plating layer is very bad. By using Ar ion sputtering and X-ray photoelectron spectroscopy, the oxygen contents between the copper plating layer and iron substrate were examined and the existence of oxygen layer was proved. Through adding assistant complexing agent and controlling initial current density, cathodic polarization was intensified in cyanide-free electrolyte. When the deposition potential of copper is less than activation potential of the iron substrate, the potential activation process was shown. The bond intensity of the plating layer is close to that of cyanide copper plating.

Key words: Electrodeposition, Initial process, Potential activation, Bond intensity, Depth profiling, X-ray photoelectron spectra