Register
ISSN 1000-6818CN 11-1892/O6CODEN WHXUEU
Acta Phys Chim Sin >> 2002,Vol.18>> Issue(03)>> 284-288     doi: 10.3866/PKU.WHXB20020320         中文摘要
Study on a New Activation Method for Initiating Electroless Plating on Alumina Powders Based on SAMs Bonded Palladium
Xu Li-Na;Xu Hong-Fei;Zhou Kai-Chang;Xu Ai-Qun;Yue Zeng-Quan;Gu Ning;Zhang Hai-Qian;Liu Ju-Zheng;Chen Kun-Ji
State Laboratory of Molecular and Biomolecular Electronics,Department of Chemistry and Chemical Engineering,Center of Analysis and Test,Southeast University,Nanjing 210096;State Key Laboratory of Solid State microstructures,Nanjing University,Nanjing 210093
Full text: PDF (1888KB) Export: BibTeX | EndNote (RIS)
Electroless plating on nonmetallic species requires the surface to be metallized.Typically the catalytic palladium nuclei are adsorbed on the particles via stannous chloride sensitization.In this paper,a new activation method has been developed for initiating electroless copper plating on alumina powder based on palladium chemisorption on SAMs of 3Aminopropyltriethoxysilane (APTS) in the absence of SnCl2 sensitization.XPS study indicates that chemsorption of palladium on the surfaces was achieved by bonding palladium chloride to the outwards pendant amino group of the SAMs.Therefore,the palladium is not easily to be desorpted.The metallized product was characterized by XRD,FTIR and crosssection metallography.The results showed that alumina was covered by a uniform fccstructured crystalline copper layer about 2 μm thick.This concerned activation method has the advantages of decreasing the thickness of the activation layer,improving the storage life of the activated powders and enhancing adhesion between the deposited metal and the substrate without roughening conditioning.It could also be extended to other substrates with hydroxylated surfaces.

Keywords: Selfassembled monolayers (SAMs)   Palladium chemsorption   Activation method   Alumina powder   Electroless plating  
Received: 2001-08-18 Accepted: 2001-12-02 Publication Date (Web): 2002-03-15
Corresponding Authors: Xu Li-Na Email: xulina@sen.edu.cn


Cite this article: Xu Li-Na;Xu Hong-Fei;Zhou Kai-Chang;Xu Ai-Qun;Yue Zeng-Quan;Gu Ning;Zhang Hai-Qian;Liu Ju-Zheng;Chen Kun-Ji. Study on a New Activation Method for Initiating Electroless Plating on Alumina Powders Based on SAMs Bonded Palladium[J]. Acta Phys. -Chim. Sin., 2002,18 (03): 284-288.    doi: 10.3866/PKU.WHXB20020320
1. YANG Li-Kun, YANG Fang-Zu, TIAN Zhong-Qun, ZHOU Shao-Min.Initial Behavior of the Electroless Nickel Deposition on Pretreated Aluminum[J]. Acta Phys. -Chim. Sin., 2012,28(02): 414-420
2. YANG Fang-Zu, WU Wei-Gang, TIAN Zhong-Qun, ZHOU Shao-Min.Application of Copper Electrochemical Deposition for the Metallization of Micropores[J]. Acta Phys. -Chim. Sin., 2011,27(09): 2135-2140
3. JIA Fei, WANG Zhou-Cheng.Electrochemical Study on Electroless Nickel Plating Using Sodium Borohydride as the Reductant[J]. Acta Phys. -Chim. Sin., 2011,27(03): 633-640
4. YANG Fang-Zu;YANG Bin;LU Bin-Bin;HUANG Ling;XU Shu-Kai;ZHOU Shao-Min .Electrochemical Study on Electroless Copper Plating Using Sodium Hypophosphite as Reductant[J]. Acta Phys. -Chim. Sin., 2006,22(11): 1317-1320
5. LIU Hui-Yu;CHEN Dong;TANG Fang-Qiong;LING Hui;REN Xiang-Ling.Fabrication of Silver Nanoshells on Modified Polystyrene Microspheres through Electroless Plating Approach[J]. Acta Phys. -Chim. Sin., 2006,22(05): 644-648
6. LIU Jia-qin; WU Yu-cheng; XUE Ru-jun.Electroless Plating Ni-Co-P Alloy on the Surface of Fly Ash Cenospheres[J]. Acta Phys. -Chim. Sin., 2006,22(02): 239-243
7. HU Guang-hui; WU Hui-huang; YANG Fang-zu.Corrosion Resistance of Electroless Ni-P Deposits and Its Relation to P Contents[J]. Acta Phys. -Chim. Sin., 2005,21(11): 1299-1302
8. Li Song-Mei;Chen Dong-Mei;Liu Jian-Hua.

Preparation and Electromagnetic Performance of Cu/T-ZnO Whiskers Composite Powders by Electroless Copper Plating

[J]. Acta Phys. -Chim. Sin., 2004,20(11): 1389-1393

9. Gu Xin;Hu Guang-Hui;Wang Zhou-Cheng;Lin Chang-Jian.In situ Investigation on the Behavior of Mixed Potential in Electroless Copper Plating[J]. Acta Phys. -Chim. Sin., 2004,20(02): 113-117
10. Niu Zhen-Jiang;Wu Ting-Hua;Li Ze-Lin.In situ XRD Investigation on the Crystallization Behaviors of Electroless High-Phosphorous Ni-P Alloys[J]. Acta Phys. -Chim. Sin., 2003,19(08): 705-708
11. Zhang Guo-Dong.Study on the Reaction Rate and Mechanism of Ni-P Electroless Plating[J]. Acta Phys. -Chim. Sin., 1998,14(05): 429-434
Copyright © 2006-2016 Editorial office of Acta Physico-Chimica Sinica
Address: College of Chemistry and Molecular Engineering, Peking University, Beijing 100871, P.R.China
Service Tel: +8610-62751724 Fax: +8610-62756388 Email:whxb@pku.edu.cn
^ Top