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Acta Physico-Chimica Sinica  2011, Vol. 27 Issue (03): 633-640    DOI: 10.3866/PKU.WHXB20110302
Electrochemical Study on Electroless Nickel Plating Using Sodium Borohydride as the Reductant
JIA Fei, WANG Zhou-Cheng
Department of Chemical and Biochemical Engineering, College of Chemistry and Chemical Engineering, Xiamen University, Xiamen 361005, Fujian Province, P. R. China
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We studied electroless Ni-B plating with sodium borohydride as the reductant by linear sweep voltammetry. The effects of bath solution composition and operating conditions on the cathodic reduction and anodic oxidation were studied. Increases in the concentrations of nickel acetate and sodium borohydride accelerated the reduction of Ni2+ and the oxidation of BH4-, respectively. Ethylenediamine, sodium hydroxide, thiourea and saccharin sodium inhibited both the cathodic and anodic reactions to varying degrees. Additionally, sulfur in the additives promoted the dissolution of nickel. High temperature was beneficial to both the cathodic reduction and anodic oxidation.

Key wordsElectroless nickel plating      Cathodic reduction      Anodic oxidation      Polarization      Additive      Adsorption     
Received: 23 September 2010      Published: 18 January 2011
MSC2000:  O646  

The project was supported by the National Natural Science Foundation of China (20573086).

Corresponding Authors: WANG Zhou-Cheng     E-mail:
Cite this article:

JIA Fei, WANG Zhou-Cheng. Electrochemical Study on Electroless Nickel Plating Using Sodium Borohydride as the Reductant. Acta Physico-Chimica Sinica, 2011, 27(03): 633-640.

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