Acta Phys. -Chim. Sin. ›› 2012, Vol. 28 ›› Issue (02): 414-420.doi: 10.3866/PKU.WHXB201112011

• ELECTROCHEMISTRY AND NEW ENERGY • Previous Articles     Next Articles

Initial Behavior of the Electroless Nickel Deposition on Pretreated Aluminum

YANG Li-Kun, YANG Fang-Zu, TIAN Zhong-Qun, ZHOU Shao-Min   

  1. State Key Laboratory of Physical Chemistry of Solid Surfaces, College of Chemistry and Chemical Engineering, Xiamen University, Xiamen 361005, Fujian Province, P. R. China
  • Received:2011-10-08 Revised:2011-11-16 Published:2012-01-11
  • Contact: YANG Fang-Zu E-mail:fzyang@xmu.edu.cn
  • Supported by:

    The project was supported by the National Natural Science Foundation of China (20873114, 20833005, 21021002), National Key Basic Research Program of China (973) (2009CB930703), and Science and Technology Project of Fujian Province, China (2009H4020).

Abstract: The initial behavior of electroless nickel deposition on aluminum pretreated by nickel immersion and electroless nickel pre-plating processes was studied measuring the open circuit potential (OCP) as a function of time (EOCP-t). Scanning electron microscopy (SEM) was used to observe the surface morphology of the pretreated specimens. During the initial stages of the electroless nickel deposition, all pretreated and un-pretreated aluminum substrates experienced removal of the oxide film, activation, mixed control and electroless nickel deposition. After nickel immersion and electroless nickel pre-plating, fine nickel particles were attached to the surface of the aluminum. Our experimental results, including EOCP-t and SEM, indicate that electroless nickel plating in a weak acidic bath was successfully accomplished on the aluminum pretreated with a double treatment of electroless nickel pre-plating in an alkaline nickel solution containing a complexing agent and a reductant. The nickel coating obtained adhered to the aluminum substrate, had a granular appearance and an amorphous structure.

Key words: Electroless nickel plating, Aluminum, Nickel immersion, Electroless nickel pre-plating, Open circuit potential

MSC2000: 

  • O646