铝表面前处理及化学沉积镍初期行为

doi:10.3866/PKU.WHXB201112011

Abstract

Abstract: The initial behavior of electroless nickel deposition on aluminum pretreated by nickel immersion and electroless nickel pre-plating processes was studied measuring the open circuit potential (OCP) as a function of time (E_OCP-t). Scanning electron microscopy (SEM) was used to observe the surface morphology of the pretreated specimens. During the initial stages of the electroless nickel deposition, all pretreated and un-pretreated aluminum substrates experienced removal of the oxide film, activation, mixed control and electroless nickel deposition. After nickel immersion and electroless nickel pre-plating, fine nickel particles were attached to the surface of the aluminum. Our experimental results, including E_OCP-t and SEM, indicate that electroless nickel plating in a weak acidic bath was successfully accomplished on the aluminum pretreated with a double treatment of electroless nickel pre-plating in an alkaline nickel solution containing a complexing agent and a reductant. The nickel coating obtained adhered to the aluminum substrate, had a granular appearance and an amorphous structure.

Key words: Electroless nickel plating, Aluminum, Nickel immersion, Electroless nickel pre-plating, Open circuit potential

MSC2000:

O646

YANG Li-Kun, YANG Fang-Zu, TIAN Zhong-Qun, ZHOU Shao-Min. Initial Behavior of the Electroless Nickel Deposition on Pretreated Aluminum[J].Acta Phys. -Chim. Sin., 2012, 28(02): 414-420.

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Initial Behavior of the Electroless Nickel Deposition on Pretreated Aluminum

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