铝表面前处理及化学沉积镍初期行为

doi:10.3866/PKU.WHXB201112011

Abstract

Abstract: The initial behavior of electroless nickel deposition on aluminum pretreated by nickel immersion and electroless nickel pre-plating processes was studied measuring the open circuit potential (OCP) as a function of time (E_OCP-t). Scanning electron microscopy (SEM) was used to observe the surface morphology of the pretreated specimens. During the initial stages of the electroless nickel deposition, all pretreated and un-pretreated aluminum substrates experienced removal of the oxide film, activation, mixed control and electroless nickel deposition. After nickel immersion and electroless nickel pre-plating, fine nickel particles were attached to the surface of the aluminum. Our experimental results, including E_OCP-t and SEM, indicate that electroless nickel plating in a weak acidic bath was successfully accomplished on the aluminum pretreated with a double treatment of electroless nickel pre-plating in an alkaline nickel solution containing a complexing agent and a reductant. The nickel coating obtained adhered to the aluminum substrate, had a granular appearance and an amorphous structure.

Key words: Electroless nickel plating, Aluminum, Nickel immersion, Electroless nickel pre-plating, Open circuit potential

MSC2000:

O646

YANG Li-Kun, YANG Fang-Zu, TIAN Zhong-Qun, ZHOU Shao-Min. Initial Behavior of the Electroless Nickel Deposition on Pretreated Aluminum[J].Acta Phys. -Chim. Sin., 2012, 28(02): 414-420.

References

(1) Chen, C. Y.; Lin, K. Y.; Tsai,W. T.; Chang, J. K.; Tseng, C. M. In. J. Hydrog. Energy 2010, 35(11), 5490.
(2) Kar, K. K.; Sathiyamoorthy, D. J. Mater. Process. Technol. 2009, 209(6), 3022.
(3) Lee, C. K. Material Chemistry and Physics 2009, 114(1), 125.
(4) Niwa, D.; Takano, N.; Yamada, T.; Osaka, T. Electrochimi. Acta 2003, 48(9), 1295.
(5) Gu, C. D.; Lian, J. S.; Li, G. Y.; Niu, L. Y.; Jiao, Z. H. Surf. Coat. Technol. 2005, 197(1), 61.
(6) Jia, F.;Wang, Z. C. Acta Phys.-Chim. Sin. 2011, 27(3), 633. [贾飞, 王周成. 物理化学学报, 2011, 27(3), 633.]
(7) Gao, Y.; Zhen, Z. J.; Cao, D. H. Electroplating and Pollution Control 2005, 25(2), 21. [高岩, 郑志军, 曹达华. 电镀与环保, 2005, 25(2), 21.]
(8) Zhao, M. J.; Cai, C.;Wang, L.; Zhang, Z.; Zhang, J. Q. Surf. Coat. Technol. 2010, 205(7), 2160.
(9) Huang, X.M.; Jiang, L. M.; Li, N.; Li, D. Y. Corrosion Science and Protection Technology 2006, 18(2), 107. [黄晓梅, 蒋丽敏, 李宁, 黎德育. 腐蚀科学与防护技术, 2006, 18(2), 107.]
(10) Yin, G. G. Surface Technology 2004, 33(2), 43. [尹国光. 表面技术, 2004, 33(2), 43.]
(11) Li, X. Y.; Zeng, X. G.; Zheng, X.W.; Liang,W. Plating & Finishing 2011, 33(8), 38. [李新跃, 曾宪光, 郑兴文, 梁伟. 电镀与精饰, 2011, 33(8), 38.]
(12) Takács, D.; Sziráki, L.; Török, T. I.; Sólyom, J.; Gácsi, Z.; Gál-Solymos, K. Surf. Coat. Technol. 2007, 201(8), 4526.
(13) Kou, S. C.; Hung, A. Plating & Surface Finishing 2003, 90(3), 44.
(14) Kou, S. C.; Hung, A. Plating & Surface Finishing 2002, 89(2), 48.
(15) Tong, H.;Wang, C. M. Acta Chim. Sin. 2002, 60(11), 1923. [佟浩, 王春明. 化学学报, 2002, 60(11), 1923.]
(16) Ma, M. R.; Deng, S. T.;Wang, G. X.; Li, N. Electroplating & Pollution Control 2006, 26(4), 26. [马梅容, 邓舒太, 王桂香, 李宁. 电镀与环保, 2006, 26(4), 26.]
(17) Ger, M. D.; Sung, Y.; Ou, J. L. Materials Chemistry and Physics 2005, 89(2-3),383.
(18) Elsentriecy, H. H.; Azumi, K.; Konno, H. Electrochimi. Acta 2007, 53(2), 1006.
(19) Elsentriecy, H. H.; Azumi, K. J. Electrochem. Soc. 2009, 156(2), 70.
(20) Elsentriecy, H. H.; Azumi, K.; Konno, H. Surf. Coat. Technol. 2007, 202(3), 532.
(21) Gu, X.; Hu, G. H.;Wang, Z. C.; Lin, C. J. Acta Phys.-Chim. Sin. 2004, 20(2), 113. [谷新, 胡光辉, 王周成, 林昌健. 物理化学学报, 2004, 20(2), 113.]
(22) Wang, G. X.; Li, N.; Tu, Z. M. Materials Protection 2005, 38 (5), 1. [王桂香, 李宁, 屠振密. 材料保护, 2005, 38(5), 1.]
(23) Yang, F. Z.; Cheng, M. H.; Huang, X. J.; Tian, Z. Q.; Zhou, S. M. Electrochemistry 2010, 16(4), 1. [杨防祖, 陈明辉, 黄夏菁, 田中群, 周绍民. 电化学, 2010, 16(4), 1.]
(24) Gou, Y. N.; Huang,W. J.; Chen,W. B.; Tan, G. F.; Xue, Y. Corrosion and Protection 2010, 31(3): 225. [沟引宁, 黄伟九, 陈文彬, 谈国峰, 薛燕. 腐蚀与防护, 2010, 31(3): 225.]
(25) He, Z. C.; Qin, T. N.; Ding, Y.; Ma, L. Q. Light Alloy Fabrication Technology 2009, 37(3), 44. [贺忠臣, 秦铁男, 丁毅, 马立群. 轻合金加工技术, 2009, 37(3), 44.]
(26) Gu, C. D.; Lian, J. S.; Li, G. Y.; Niu, L. Y.; Jiao, Z. H. J. Alloy. Comp. 2005, 391(1-2), 104.

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Initial Behavior of the Electroless Nickel Deposition on Pretreated Aluminum

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