| 2013, Vol. 29(12): 2579-2584 DOI: 10.3866/PKU.WHXB201310092 | ||
| Electrocrystallization of Cu-Sn Alloy on Copper Electrode Surface | ||
| SHI Ji-Peng, YANG Fang-Zu, TIAN Zhong-Qun, ZHOU Shao-Min | ||
| State Key Laboratory of Physical Chemistry of Solid Surfaces, College of Chemistry and Chemical Engineering, Xiamen University, Xiamen 361005, Fujian Province, P. R. China | ||
| Received 2013-07-30 Revised 2013-10-07 | ||
| Supporting info | ||