Cure Kinetics of Epoxy Resin System Toughened by Polyhexamethylene Carbonate Diol
Chen Tong-Hui,Bai Yao-Wen,Sun Ren-Hui
Acta Phys. -Chim. Sin. . 1997, (09): 848 -852 .  DOI: 10.3866/PKU.WHXB19970915