柠檬酸盐体系铜电沉积及其在微机电系统中的应用

doi:10.3866/PKU.WHXB20101002

Abstract

Abstract:

We investigated the effect of plating parameters on the coating morphology and grain size of copper using a novel citrate bath. The structure and deposit were characterized by X-ray diffraction (XRD) and X-ray photoelectron spectroscopy (XPS), respectively. The copper plating bath was applied to a micro-electro-mechanical system (MEMS). Results show that an even and compact copper coating was obtained for the fine grains using plating parameters of 6g·L^-1Cu²⁺, pH=7.0-8.5, 1-2A·dm^-2, 45 ℃, and bath agitation. The deposit consists of pure copper in a fcc polycrystalline structure.A planar inductor was successfully fabricated by MEMS using this bath and its maximum quality factor was 12.75, which satisfies the design requirements.

Key words: Electrodeposition, Citrate, Copper, Deposit characterization, Planar inductor, Micro -electro -mechanical system

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WU Wei-Gang, YANG Fang-Zu, LUO Ming-Hui, TIAN Zhong-Qun, ZHOU Shao-Min. Electrodeposition of Copper in a Citrate Bath and Its Application to a Micro-Electro-Mechanical System[J]. Acta Phys. -Chim. Sin. 2010, 26(10), 2625-2632. doi: 10.3866/PKU.WHXB20101002

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Electrodeposition of Copper in a Citrate Bath and Its Application to a Micro-Electro-Mechanical System

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