Acta Phys. -Chim. Sin. ›› 2013, Vol. 29 ›› Issue (12): 2579-2584.doi: 10.3866/PKU.WHXB201310092

• ELECTROCHEMISTRY AND NEW ENERGY • Previous Articles     Next Articles

Electrocrystallization of Cu-Sn Alloy on Copper Electrode Surface

SHI Ji-Peng, YANG Fang-Zu, TIAN Zhong-Qun, ZHOU Shao-Min   

  1. State Key Laboratory of Physical Chemistry of Solid Surfaces, College of Chemistry and Chemical Engineering, Xiamen University, Xiamen 361005, Fujian Province, P. R. China
  • Received:2013-07-30 Revised:2013-10-07 Published:2013-11-28
  • Contact: YANG Fang-Zu
  • Supported by:

    The project was supported by the National Natural Science Foundation of China (21021002) and National Key Basic Research Program of China (973) (2009CB930703).


The co-deposition and electrocrystallization of Cu-Sn alloy in a weak acidic citrate bath were studied by linear sweep voltammetry (LSV), cyclic voltammetry (CV), and chronoamperometry. The Scharifker- Hill (SH) theory model and Heerman-Tarallo (HT) theory model were applied to analyze the chronoamperometry data. The results show that the Cu-Sn alloy co-deposited on copper electrode, following instantaneous nucleation with three-dimensional (3D) growth under diffusion control. The kinetic parameters were obtained using the HT model. As the step potential shifted from -0.80 to -0.85 V, the nucleation rate constant (A) increased from 20.19 to 177.67 s-1, the density of active nucleation sites (N0) increased from 6.10×105 to 1.42×106 cm-2, and the diffusion coefficient (D) was (6.13±0.62)×10-6 cm2·s-1.

Key words: Cu-Sn alloy, Electrocrystallization, Cyclic voltammetry, Chronoamperometry