Electrochemical Corrosion Behavior of Copper Clad Laminate in NaCl Solution
ZHAO Yan; LIN Chang-Jian; LI Yan; DU Rong-Gui; WANG Jing-Run
Acta Phys. -Chim. Sin. . 2007, (09): 1342 -1346 .  DOI: 10.1016/S1872-1508(07)60070-9