Acta Phys. -Chim. Sin. ›› 1994, Vol. 10 ›› Issue (05): 452-455.doi: 10.3866/PKU.WHXB19940516

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Photoelectrochemical Study on the Corrosion Behavior of Copper in 3% NaCl Solution

Ren Ju-Jie, Yang Mai-Zhi, Tong Ru-Ting, Guo Qin-Lin, Cai Sheng-Min, Zhou Guo-Ding   

  1. Department of Chemistry, Hebei University 050016; Department of Chemistry, Peking Univeristy 100871; Department of Thermal Power Engineering, Shanghai Institute of Electric Power 200090
  • Received:1992-10-20 Revised:1993-03-22 Published:1994-05-15
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Abstract:

The corrosion behavior of copper in 3% NaCl solutions has been investigated using AES. XPS and photoelectrochemical tectniques. The results show that Cl~- has remarkable influence on the corrosion behavior of copper. With the increasing immersion time, the photoresponse of copper electrode changes from p-type to n-type gradually, and the invasion degree of Cl~- ions on copper electrode increases. Finally, the band gap of the sedriconduct film formed on copper electrode surface is 1.7 eV.

Key words: Cu, Photocurrent (Iph), Open circuit photovoltage (Voph), Cl-