铜电极表面铜锡合金电结晶机理

doi:10.3866/PKU.WHXB201310092

物理化学学报 >> 2013, Vol. 29 >> Issue (12): 2579-2584.doi: 10.3866/PKU.WHXB201310092

铜电极表面铜锡合金电结晶机理

史纪鹏, 杨防祖, 田中群, 周绍民

厦门大学化学化工学院, 固体表面物理化学国家重点实验室, 福建厦门 361005

收稿日期:2013-07-30 修回日期:2013-10-07 发布日期:2013-11-28
通讯作者: 杨防祖 E-mail:fzyang@xmu.edu.cn
基金资助:
国家自然科学基金(21021002)及国家重点基础研究发展计划(973) (2009CB930703)资助项目

Electrocrystallization of Cu-Sn Alloy on Copper Electrode Surface

SHI Ji-Peng, YANG Fang-Zu, TIAN Zhong-Qun, ZHOU Shao-Min

State Key Laboratory of Physical Chemistry of Solid Surfaces, College of Chemistry and Chemical Engineering, Xiamen University, Xiamen 361005, Fujian Province, P. R. China

Received:2013-07-30 Revised:2013-10-07 Published:2013-11-28
Contact: YANG Fang-Zu E-mail:fzyang@xmu.edu.cn
Supported by:
The project was supported by the National Natural Science Foundation of China (21021002) and National Key Basic Research Program of China (973) (2009CB930703).

摘要/Abstract

摘要：

在弱酸性柠檬酸盐体系铜锡合金镀液中, 采用线性扫描伏安(LSV)、循环伏安(CV)和计时安培实验方法, 运用Scharifker-Hills (SH)理论模型和Heerman-Tarallo (HT)理论模型分析拟合实验结果, 研究铜锡合金在铜电极上的电沉积过程与电结晶机理. 结果表明, 铜锡合金在铜电极表面实现共沉积并遵循扩散控制下三维瞬时成核的电结晶过程. 电位阶跃从-0.80 V负移至-0.85 V (vs SCE), HT理论分析得到铜锡合金的成核与生长的动力学参数分别为成核速率常数(A)值从20.19 s^-1增加至177.67 s^-1, 成核活性位点密度数(N₀)从6.10×10⁵ cm^-2提高至1.42×10⁶ cm^-2, 扩散系数(D)为(6.13±0.62)×10^-6 cm²·s^-1.

关键词: 铜锡合金, 电结晶, 循环伏安, 计时安培曲线

Abstract:

The co-deposition and electrocrystallization of Cu-Sn alloy in a weak acidic citrate bath were studied by linear sweep voltammetry (LSV), cyclic voltammetry (CV), and chronoamperometry. The Scharifker- Hill (SH) theory model and Heerman-Tarallo (HT) theory model were applied to analyze the chronoamperometry data. The results show that the Cu-Sn alloy co-deposited on copper electrode, following instantaneous nucleation with three-dimensional (3D) growth under diffusion control. The kinetic parameters were obtained using the HT model. As the step potential shifted from -0.80 to -0.85 V, the nucleation rate constant (A) increased from 20.19 to 177.67 s^-1, the density of active nucleation sites (N₀) increased from 6.10×10⁵ to 1.42×10⁶ cm^-2, and the diffusion coefficient (D) was (6.13±0.62)×10^-6 cm²·s^-1.

Key words: Cu-Sn alloy, Electrocrystallization, Cyclic voltammetry, Chronoamperometry

点击下载补充材料PDF格式文件

史纪鹏, 杨防祖, 田中群, 周绍民. 铜电极表面铜锡合金电结晶机理[J]. 物理化学学报, 2013, 29(12), 2579-2584. doi: 10.3866/PKU.WHXB201310092

SHI Ji-Peng, YANG Fang-Zu, TIAN Zhong-Qun, ZHOU Shao-Min. Electrocrystallization of Cu-Sn Alloy on Copper Electrode Surface[J]. Acta Phys. -Chim. Sin. 2013, 29(12), 2579-2584. doi: 10.3866/PKU.WHXB201310092

链接本文: https://www.whxb.pku.edu.cn/CN/10.3866/PKU.WHXB201310092

https://www.whxb.pku.edu.cn/CN/Y2013/V29/I12/2579

参考文献

(1) Hoffacker, G.; Kaiser, H.; Reissmueller, K.;Wirth, G. Cyanidic-Alkaline Baths for the Galvanic Deposition of Copper-tin AlloyCoatings, Uses Thereof, and Metallic Bases Coated with SaidCopper-tin Alloy Coating. US Patent: US 5534129, 1996-07-09.
(2) Correia, A. N.; Façanha, M. X.; de Lima-Neto, P. Surf. Coat. Technol. 2007, 201 (16), 7216.
(3) Hovestad, A.; Tacken, R. A. Physica Status Solidi (c) 2008, 5 (11), 3506. doi: 10.1002/pssc.v5:11
(4) Sürme, Y.; Gürten, A. A.; Bayol, E.; Ersoy, E. J. Alloy. Compd.2009, 485 (1), 98.
(5) Finazzi, G. A.; De Oliveira, E. M.; Carlos, I. A. Surf. Coat. Technol. 2004, 187 (2), 377.
(6) Low, C. T. J.;Walsh, F. C. Surf. Coat. Technol. 2008, 202 (8),1339. doi: 10.1016/j.surfcoat.2007.06.032
(7) Scharifker, B.; Hills, G. Electrochim. Acta 1983, 28 (7), 879.doi: 10.1016/0013-4686(83)85163-9
(8) Palomar-Pardavé, M.; Scharifker, B. R.; Arce, E. M.; Romero-Romo, M. Electrochim. Acta 2005, 50 (24), 4736. doi: 10.1016/j.electacta.2005.03.004
(9) Ballesteros, J. C.; Chainet, E.; Ozil, P.; Meas, Y.; Trejo, G. Int. J. Electrochem. Sci. 2011, 6, 2632.
(10) Gu, M.; Zhong, Q. J. Appl. Electrochem. 2011, 41 (7), 765. doi: 10.1007/s10800-011-0293-0
(11) Rudnik, E.;Wojnicki, M.;Wιoch, G. Surf. Coat. Technol. 2012,207, 375. doi: 10.1016/j.surfcoat.2012.07.027
(12) Garfias-García, E.; Romero-Romo, M.; Ramírez-Silva, M. T.;Palomar-Pardavé, M. Int. J. Electrochem. Sci. 2012, 7, 3102.
(13) Scharifker, B. R.; Mostany, J. J. Electroanal. Chem. 1984, 177,13. doi: 10.1016/0022-0728(84)80207-7
(14) Sluyters-Rehbach, M.;Wijenberg, J. H. O. J.; Bosco, E.;Sluyters, J. H. J. Electroanal. Chem. 1987, 236 (1), 1.
(15) Heerman, L.; Tarallo, A. J. Electroanal. Chem. 1998, 451 (1),101.
(16) Heerman, L.; Tarallo, A. J. Electroanal. Chem.1999, 470 (1),70. doi: 10.1016/S0022-0728(99)00221-1
(17) Yue, J. P.; Yang, F. Z.; Tian, Z. Q.; Zhou, S. M. Acta Phys. -Chim.Sin. 2011, 27 (6), 1446. [岳俊培, 杨防祖, 田中群, 周绍民. 物理化学学报, 2011, 27 (6), 1446.] doi: 10.3866/PKU.WHXB20110620
(18) Zhou, L.; Dai, Y.; Zhang, H.; Jia, Y.; Zhang, J.; Li, C. Bull. Korean Chem. Soc. 2012, 33 (5), 1541. doi: 10.5012/bkcs.2012.33.5.1541
(19) Lomax, D. J.; Kinloch, I. A.; Dryfe, R. A.W. AuElectrodeposition on Carbon Materials. In Nanotechnology (IEEE-NANO), 2012 12th IEEE Conference onNanotechnology, Birmingham, United Kingdom, Aug 20-23,2012; IEEE; 2012; pp 1-4.
(20) Granados-Ner, M.; Huizar, L. H. M.; Rios-Reyes, C. H.Química Nova 2011, 34 (3), 439.
(21) Emekli, U.;West, A. C. Electrochim. Acta 2009, 54 (4),1177. doi: 10.1016/j.electacta.2008.08.065
(22) Zhang, Q. B.; Hua, Y. X. J. Appl. Electrochem. 2011, 41 (6),705. doi: 10.1007/s10800-011-0283-2
(23) Pewnim, N.; Roy, S. Electrochim. Acta 2013, 90, 498. doi: 10.1016/j.electacta.2012.12.053
(24) Fletcher, S. Electrochim. Acta 1983, 28 (7), 917. doi: 10.1016/0013-4686(83)85167-6
(25) Bard, A. J.; Faulkner, L. R. Electrochemical Methods: Fundamental and Applications, 2nd ed.; JohnWiley: New York,2001; pp 234-236.
(26) Ying, R. Y. J. Electrochem. Soc. 1988, 135 (12), 2957. doi: 10.1149/1.2095469
(27) Barry, F. J.; Cunnane, V. J. J. Electroanal. Chem. 2002, 537 (1),151.
(28) Hu,W.; Tan, C. Y.; Cui, H.; Zheng, Z. Q. The Chinese Journal of Nonferrous Metals 2010, 20 (5), 1006. [胡炜, 谭澄宇,崔航, 郑子樵. 中国有色金属学报, 2010, 20 (5), 1006.]
(29) Michailova, E.; Milchev, A. J. Appl. Electrochem. 1991, 21 (2),170. doi: 10.1007/BF01464299

[1]	曲红梅,种泽鹏,陈旭,门奕灿,申海蛟. 二萘并噻咯的合成及性能[J]. 物理化学学报, 2017, 33(6): 1253 -1260 .
[2]	吴小英,杨丽坤,闫慧,杨防祖,田中群,周绍民. n型半导体硅电极表面Au的电化学成核机理[J]. 物理化学学报, 2015, 31(9): 1708 -1714 .
[3]	彭中, 阎文艺, 王少娜, 郑诗礼, 杜浩, 张懿. NaOH溶液中碱浓度、氧气压力以及温度对Pt电极上氧气还原反应的影响[J]. 物理化学学报, 2014, 30(1): 67 -74 .
[4]	宋晗, 王娜娜, 李悦, 阮文娟. 含末端炔基的Salen型金属配合物的合成、表征及性质[J]. 物理化学学报, 2013, 29(11): 2300 -2307 .
[5]	吴京珂, 沈兴海, 陈庆德. CMPO-离子液体萃取分离铀(VI)体系的电化学性质[J]. 物理化学学报, 2013, 29(08): 1705 -1711 .
[6]	徐颖华, 马红星, 蔡倩倩, 朱英红, 马淳安. 乙腈溶剂中三氯化苄在银阴极上的脱氯反应[J]. 物理化学学报, 2013, 29(05): 973 -980 .
[7]	张超, 敖建平, 王利, 姜韬, 孙国忠, 何青, 周志强, 孙云. Ga和Cu/In衬底上电沉积金属Ga[J]. 物理化学学报, 2012, 28(08): 1913 -1922 .
[8]	金荣荣, 李丽芳, 徐雪峰, 连英惠, 赵凡. 水滑石负载的钯纳米粒子对水合肼的电催化氧化[J]. 物理化学学报, 2012, 28(08): 1929 -1935 .
[9]	王艳艳, 姜艳霞, 沙德礼, 罗德礼, 孙世刚. 电化学和紫外-可见吸收光谱法研究pH和金纳米粒子对细胞色素c的影响[J]. 物理化学学报, 2012, 28(05): 1127 -1133 .
[10]	颜秉熙, 罗胜耘, 沈杰. 直流反应磁控溅射制备的Mo掺杂TiO₂薄膜的光电特性[J]. 物理化学学报, 2012, 28(02): 381 -386 .
[11]	徐莉, 乔锦丽, 丁蕾, 胡隆宇, 刘玲玲, 王海江. CoPy/C催化剂应用碱性介质氧还原催化的电化学性能[J]. 物理化学学报, 2011, 27(10): 2251 -2254 .
[12]	屠晓华, 褚有群, 马淳安. 质子惰性介质中芳香族硝基化合物在铂微电极上的电化学行为[J]. 物理化学学报, 2011, 27(09): 2148 -2152 .
[13]	岳俊培, 杨防祖, 田中群, 周绍民. 钯镍合金在玻碳电极上电结晶机理[J]. 物理化学学报, 2011, 27(06): 1446 -1450 .
[14]	汪莲艳, 陆枫, 吴福全, 顾仁敖, 姚建林, 张海禄, 邓宗武. 金属螯合物印迹聚邻苯二胺膜的电化学合成及表征[J]. 物理化学学报, 2011, 27(06): 1451 -1456 .
[15]	王志平, 罗虹, 高丽华, 王科志. 一种噻吩基双偶极半菁与普鲁士蓝的静电自组装薄膜[J]. 物理化学学报, 2011, 27(03): 754 -758 .

铜电极表面铜锡合金电结晶机理

Electrocrystallization of Cu-Sn Alloy on Copper Electrode Surface

PDF

赞

可视化

摘要/Abstract

支持信息

引用本文

使用本文

参考文献

相关文章 15

Metrics

推荐阅读 0