Acta Phys. -Chim. Sin. ›› 2025, Vol. 41 ›› Issue (5): 100045.doi: 10.1016/j.actphy.2025.100045
• ARTICLE • Previous Articles Next Articles
Jiahao Lu1, Xin Ming1, Yingjun Liu1,2,*(
), Yuanyuan Hao1, Peijuan Zhang1, Songhan Shi1, Yi Mao1, Yue Yu1, Shengying Cai3, Zhen Xu1,2, Chao Gao1,2,*(
)
Received:2024-07-04
Revised:2024-08-22
Accepted:2024-08-26
Published:2025-04-18
Contact:
Email: yingjunliu@zju.edu.cn (Yingjun Liu)chaogao@zju.edu.cn (Chao Gao)
Supported by:Jiahao Lu, Xin Ming, Yingjun Liu, Yuanyuan Hao, Peijuan Zhang, Songhan Shi, Yi Mao, Yue Yu, Shengying Cai, Zhen Xu, Chao Gao. High-Precision and Reliable Thermal Conductivity Measurement for Graphene Films Based on an Improved Steady-State Electric Heating Method[J]. Acta Phys. -Chim. Sin. 2025, 41(5), 100045. doi: 10.1016/j.actphy.2025.100045
Fig 2
The proportion of the three heat transfer methods and the test error simulation results. (a) Heat transfer process diagram, (b) Thermal conductivity (λ) of samples with different thicknesses in different environments, (c–e) Proportion of three heat transfer ways in samples of different thicknesses, 25 μm (c–d) and 100 μm (e), (f) Test error variation with temperature difference (ΔT), (g) Test error variation with thickness."
Fig 3
Influence of sample size on measurement results. (a) Infrared temperature measurement image, (b–c) Chart of thermal conductivity (λ) with length (b) and width (c), (d) Schematic diagram of in-plane heat transfer in samples, (e) Infrared image of temperature distribution in the X-Y plane of the sample with different thickness, (f) Temperature distribution curve along the Y-axis at different X-axis positions, (g) Sample surface temperature distribution curves under different conditions, (h) Above the threshold plane where the temperature curve is parabolic is satisfied, (i) Temperature distribution curve of 500 μm thick film sample based on finite element simulation."
Fig 4
The influence of the test device parameters on the result. (a) Test equipment section diagram, (b) Infrared image of the same sample at different emissivity, (c) Emissivity versus temperature curves under different surfaces and calculated thermal conductivity, (d) The comparison between infrared temperature and actual temperature under different set transmittance and the calculated thermal conductivity variation of the same sample with different set transmittance, (e) Thermal conductivity (λ) varies with the number of measurements under different power test methods, (f) Infrared image under poor coating of silver glue, (g) Temperature rise and voltage drop distribution on the sample surface."
Fig 5
The influences of data analysis on test results. (a) Schematic diagram of point selection offset by traditional method, (b) Thermal conductivity (λ) calculated after the selected point offset, (c) Fitting of sample temperature distribution curve under low temperature rise, (d) The fit correlation coefficient (R2) changed with maximum temperature difference, (e) Data processing diagram of modified steady-state electric heating method, (f) Fitting diagram at a maximum temperature difference of 20 K, (g) Temperature distribution fitting diagram under different electric power, (h) temperature difference versus electric power, (i) Thermal conductivity (λ) based on the original and fitted data."
Fig 6
Performance diagram of steady-state electric heating method. (a) Comparison chart of various thermal conductivity testing methods, (b) Thermal conductivity comparison for thick films (200 μm) under various methods, (c) Illustration of sample temperature response, (d) Thermal conductivity testing stability."
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