Acta Phys. -Chim. Sin. ›› 2026, Vol. 42 ›› Issue (6): 100279.doi: 10.1016/j.actphy.2026.100279
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Advances and challenges in flexible electromagnetic protection materials for electromagnetic interference shielding and wave absorption
Shengdi Mao1, Ruifeng Miao1, Di Lan2, Shijie Zhang1,*(
), Jiguang Zhou3, Xun Liu3, Suxuan Du1,*(), Zhiwei Zhao1, Guanglei Wu4,*()
- 1 School of Material Science and Engineering, Henan University of Technology, Zhengzhou 450001, Henan Province, China
2 School of Automotive Materials, Hubei University of Automotive Technology, Shiyan 442002, Hubei Province, China
3 Zhengzhou Research Institute for Abrasives & Grinding Superhard Materials Co., Ltd., Zhengzhou 450002, Henan Province, China
4 College of Materials Science and Engineering, Qingdao University, Qingdao 266071, Shandong Province, China
-
Received:2026-01-08Revised:2026-03-04Accepted:2026-03-05Published:2026-04-21 -
Contact:Email: zsj562389@sina.com (Shijie Zhang)suxuan_du@haut.edu.cn (Suxuan Du)wuguanglei@qdu.edu.cn/wuguanglei@mail.xjtu.edu.cn (Guanglei Wu)
Cite this article
Shengdi Mao, Ruifeng Miao, Di Lan, Shijie Zhang, Jiguang Zhou, Xun Liu, Suxuan Du, Zhiwei Zhao, Guanglei Wu. Advances and challenges in flexible electromagnetic protection materials for electromagnetic interference shielding and wave absorption[J]. Acta Phys. -Chim. Sin. 2026, 42(6), 100279. doi: 10.1016/j.actphy.2026.100279
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Fig 1
Applications of Flexible EMP Materials. Flexible graphene/carbon nanotubes (CNTs)/polyurethane (PU) composite film: Reproduced with permission [22]. Copyright 2025, Elsevier. Polyetherimide (PEI)/MXene/ polyaniline (PANI) aramid fabric: Reproduced with permission [23]. Copyright 2024, Elsevier. MXene/ polyimide (PI) film: Reproduced with permission [24]. Copyright 2025, Springer Nature. Carbon/carbon (C/C) composite materials: Reproduced with permission [25]. Copyright 2022, Elsevier. Hierarchical hollow SiC micro/nanofiber sponges (HHSMSs): Reproduced with permission [26]. Copyright 2025, Springer Nature. Chitosan/CNTs/ MXene composite aerogel (CCMA): Reproduced with permission [27]. Copyright 2026, Elsevier. Fe3O4/MoS2/ reduced graphene oxide (rGO)/Ti3C2Tx MXene (FMGM) composite aerogel: Reproduced with permission [28]. Copyright 2025, ACS Publications. GO/MWCNTs/Fe3O4-polyvinylpyrrolidone (PVP) film: Reproduced with permission [29]. Copyright 2024, Elsevier."
Fig 2
(a) Schematic illustration of the proposed mechanisms underlying the enhanced EMI shielding performance of Ni-Cu-Al ferrite/PPy nanocomposites. Reproduced with permission [65]. Copyright 2025, Elsevier. (b) Schematic diagram of the fabrication process of electrospun PI nanofiber yarns. (c) EMI shielding of nanofibrous veils in X-band (8.2–12.4 GHz): SET, SER, SEA, average SET, SER, SEA. (d) Schematic diagram of EMI shielding mechanism in composite films. Reproduced with permission [66]. Copyright 2025, Elsevier. (e) Schematic illustration of the fabrication process of PEI/MXene/PANI/aramid fabric composites. (f) EMI SE of the fabricated fabrics. (g) SE values and corresponding SE loss ratios of the fabrics after repeated washing cycles. Reproduced with permission [23]. Copyright 2024, Elsevier."
Fig 3
(a) Schematic process flow for preparing PCPES/Cu films. (b) Cross-sectional SEM image and corresponding magnified view of the PCPES/Cu film, along with (c) EMI SE values. Reproduced with permission [69]. Copyright 2022, Elsevier. (d) Schematic illustration of the fabrication process of GC/PU composite films. (e) Cross-sectional SEM image of the GC/PU-2 film. (f) Surface temperature evolution of G/PU and GC/PU-2 films under stepwise applied voltages. Reproduced with permission [22]. Copyright 2025, Elsevier."
Fig 4
(a) Schematic diagram illustrating the preparation process of TPMF. (b) Proposed schematic diagram of the shielding mechanism of TPMF. (c) Cross-sectional SEM image of TF and TPMF microstructures. Reproduced with permission [71]. Copyright 2023, Elsevier. (d) Schematic diagram of the MXene-polydopamine (PDA) fabrication process and schematic diagram of the IPTES-POSS preparation process. (e) Schematic diagram of the MXene-POSS preparation process and schematic diagram of the PI/MXene-POSS preparation process. (f) Contact angle measurements for difference nanocomposite films. (g) Combustion state of the PI/MXene-POSS-10% nanocomposite film at different time intervals. Reproduced with permission [72]. Copyright 2024, Elsevier."
Fig 5
(a) Schematic illustration of the fabrication process of sea urchin-like MnO2@carbon fiber paper/CB-modified silicone rubber composites. (b) SEM image of MnO2 on the surface of carbon fibers. (c) Reflection coefficient (R) and absorption coefficient (A) curves, together with the averaged contribution histogram, as well as the SER, SEA, and SET of the composite. (d) Schematic illustration of the theoretical model for thickness-regulated dielectric behavior. Reproduced with permission [80]. Copyright 2024, Elsevier. (e) Fabrication process of C/C composites. (f) Schematic illustration of the electron transport network and electron migration behavior in C/C composites after heat treatment at different temperatures [25]. Copyright 2022, Elsevier."
Fig 6
(a) Schematic illustration of preparation of EG/PP porous composites. (b) Representative SEM micrographs. Reproduced with permission [83]. Copyright 2025, Elsevier. (c) Schematic illustration of the fabrication process of graphite/ANFs films and the corresponding EMI shielding mechanism. (d) The electrical conductivity property and (e) EMI SE of the composite films. (f) Photographs of the composite films burning over an alcohol lamp. Reproduced with permission [86]. Copyright 2025, Elsevier."
Fig 7
(a) Schematic illustration of the preparation of MXene/SWCNTs composite films. (b) SET of MXene/SWCNTs composite films. (c) Schematic illustration of the three electromagnetic attenuation loss mechanisms. (d) Optical photographs on film. Reproduced with permission [90]. Copyright 2025, Elsevier. (e) Schematic illustration of the fabrication process of graphene REGO-2000 films. (f) Schematic diagram showing EMWs propagation within the REGO-2000 film. Reproduced with permission [14]. Copyright 2023, Elsevier."
Fig 8
(a) Preparation process of the CNTs/PTFE dual-nanofiber membrane. (b) EMI shielding mechanism of the CNTs/PTFE membrane. (c) Electrical conductivity and relative resistance changes of the CNTs/PTFE membrane under mechanical deformation and chemical exposure. (d) EMI SE under various extreme conditions. Reproduced with permission [96]. Copyright 2024, Wiley. (e) Water-assisted decomposition process of CNTsP. (f) EMI SE and corresponding SER, SEA, and SET values. (g) Cyclic voltammetry responses and mechanical deformation durability of CNTs/PANI-based electrochemical capacitors. Reproduced with permission [97]. Copyright 2025, Elsevier."
Fig 9
(a) Schematic diagram of the preparation process for Ti3C2Tx and composite films. (b) SEM images of films with different MXene/PI contents. (c) EMI SE of the composite films. (d) Photographs demonstrating the flexibility of the material. Reproduced with permission [109]. Copyright 2023, Elsevier. (e) Schematic illustration of the fabrication process of TEMPO-oxidized cellulose nanofiber/MXene-CGG hydrogel composite paper. (f) Schematic illustration of the EMI shielding mechanism of the material. (g) Demonstration of the material's shielding performance against radiation emitted from a computer. Reproduced with permission [110]. Copyright 2024, Elsevier."
Fig 10
(a) Schematic diagram illustrating the fabrication process of the MXene/PI film. (b) Digital photograph of the highly flexible MXene/PI film supporting a 200-gram weight. (c) Digital photographs of the MXene/PI film after undergoing ultrasonic treatment for different durations. Digital photographs of the MXene/PI film after combustion for different durations. (d) Cross-sectional SEM image of the PI layer and MXene layer in the MXene/PI film. Reproduced with permission [24]. Copyright 2025, Springer. (e) Fabrication diagram of Ti3C2Tx MXene, Co@CNWs, Janus nanocomposite film. (f) Schematic of EMWs incidence on the Janus nanocomposite film from the Co@CNWs side. (g) Schematic of EMWs incidence on the Janus nanocomposite film from the Ti3C2Tx side. Reproduced with permission [113]. Copyright 2024, Elsevier."
Fig 11
(a) Schematic illustration of the fabrication process of PVA/MXene-CC/alumina composites. (b) Field-emission SEM image of MXene-CC. (c) EMI SE and electrical conductivity of the composite materials. Reproduced with permission [11]. Copyright 2024, Elsevier. (d) Schematic diagram of the synthesis process of nickel-embedded hollow porous Ti3C2Tx MXene films. (e) X-band shielding components of Ti3C2Tx MXene film, hollow porous Ti3C2Tx MXene film, and Ni-embedded hollow porous Ti3C2Tx MXene film samples: SEA, SER, and SET. (f) Schematic illustration of the EMI shielding mechanism of the composites. Reproduced with permission [124]. Copyright 2025, Wiley. (g) Schematic illustration of the fabrication process of PEI@MXene/PEN composite films. (h) EMI shielding mechanism of the PEI@MXene/PEN composite films. (i) Radar chart comparison of CF15 and pressed composite films 15. (j) Tensile strength and elongation at break of CFx samples. Reproduced with permission [125]. Copyright 2025, Wiley."
Fig 12
(a) Schematic illustration of the fabrication process of the Cuf/SiR composites. (b) EMI SE of the Cuf/SiR composites. Reproduced with permission [128]. Copyright 2023, Wiley. (c) Schematic diagram of the fabrication procedure of the copper mesh film. (d) EMI SET of copper meshes with different thicknesses and surface coverages in the X-band frequency range. (e) EMI SET of copper meshes in the pristine state and after 1000 bending cycles with a bending radius of 4 mm. (f) Sheet resistance and optical transmittance at 550 nm of films with different thicknesses and surface coverages. Reproduced with permission [131]. Copyright 2025, Springer."
Fig 13
(a) Schematic illustration of the fabrication of the ALG film and schematic representation of the preparation process of the ANFs dispersion. (b) Proposed EMI shielding mechanism of the ALG film. (c) Temperature evolution of the ALG film under an applied voltage of 5 V for 1800 s. (d) EMI SE of LM/ANFs-5 film and ALG film in the X-band. Reproduced with permission [137]. Copyright 2025, Elsevier. (e) Schematic illustration of the preparation of PUU and LM/PUU composites. (f) Electrical conductivity and EMI SE of the LM/PUU composites at 0%, 25%, 50%, and 100% strain. (g) Self-healing mechanism of the LM/PUU composites. Reproduced with permission [138]. Copyright 2025, Elsevier."
Fig 14
(a) Schematic for the fabrication process of CNTs@LM/polyacrylamide/gelatin (LMCPG) hydrogel. (b1) EMI SE of LMxCyPG hydrogels, including the EMI SE of LM2C1PG before and after 2000 bending cycles (b2), (b3) EMI SE as a function of tensile strain in the range of 0–500%, and (b4) the average EMI SE of LM-based hydrogels subjected to 0%, 200%, and 1000% strain during 100 tensile cycles. (c) Schematic illustration of the EMI shielding mechanism of the LMCPG hydrogel. Reproduced with permission [139]. Copyright 2023, Elsevier. (d) Schematic fabrication process of the anisotropic MXene/WPU/PPy composite aerogels. (e1) EMI SE of the aerogels measured along different directions in the X-band frequency range, as well as the (e2) evolution of EMI SE under repeated compressive deformation. Reproduced with permission [140]. Copyright 2025, Elsevier."
Fig 15
(a) Schematic diagram of the preparation process for FFSA/CNF composite films. (b) volume resistivity of CNF and FFSA/CNF composite films at various filler gradients. (c) EMI SE of 90 wt% FFSA content composite films with different thicknesses. Reproduced with permission [145]. Copyright 2025, ACS Publications. (d) Schematic diagram of the design and fabrication of G-BMH composite film. (e) SER, SEA, and SET of G-BM, G-BMF, G-BMH, and H-BMH composite films. (f) Stress-strain curves. (g) Cross-sectional SEM images of the G-BMH composite film. Reproduced with permission [146]. (h) Copyright 2025, Wiley. EMI SE coefficients value of the Ni/MWCNTs/Ni films in X-band with different contents of Ni. Reproduced with permission [147]. Copyright 2024, Elsevier."
Fig 16
(a) Schematic illustration of the experimental procedure, including the structural evolution of CF and an overview of the applications of the WPU/CF film. (b1) RL of the WPU/CF film. (b2) Influence of carbon fiber content on the dielectric loss tangent of the WPU/CF film. (b3) Influence of carbon fiber content on the imaginary part of the dielectric constant of the WPU/CF film. (b4) Influence of carbon fiber content on the real part of the dielectric constant of the WPU/CF film. Reproduced with permission [150]. Copyright 2025, Elsevier. (c) Schematic illustration of the synthesis process of the GO/MWCNTs/Fe3O4 composite. (d) 2D RL contour maps of different materials. Reproduced with permission [29]. Copyright 2024, Elsevier. (e) Schematic illustration of the fabrication process of BN/Ti/CT composites and BN/CT/CNTs/CTPU films. (f) 3D and (g) 2D RL maps of BN0.5/Ni0.5/CNTs5/WPU composites. Reproduced with permission [152]. Copyright 2024, ACS Publications."
Fig 17
(a) Schematic illustration of the synthesis process of PDMS/Fe3O4/CF composites. (b1, b2) SEM images of the PDMS/Fe3O4/CF composite. (c1, c2) RL contour mapping and 3D RL distribution of the PDMS/Fe3O4/CF-900 sample. Reproduced with permission [13]. Copyright 2023, Elsevier. (d) Schematic diagrams illustrating the fabrication of the multifunctional composite elastomer and (e) the corresponding EWA mechanisms. (f1, f2) RL contour mapping and 3D RL distribution of the material measured at room temperature. (g1, g2) RL contour mapping and 3D RL distribution of the material measured at −20 ℃. Reproduced with permission [168]. Copyright 2024, Elsevier."
Fig 18
(a) Schematic illustration of the fabrication process of the C-CNTs-Si3N4 porous foam. (b) 2D RL contour maps of C-CNTs-Si3N4 and C-CNTs-BN foams measured along the X, Y, and Z directions. Reproduced with permission [169]. Copyright 2025, Wiley. (c) Schematic representation of the fabrication process of AgFe-MF. (d) 3D projection and 3D surface plots of the RL values for AgFe3-MF. Reproduced with permission [170]. Copyright 2024, Elsevier. (e) Schematic illustration of the preparation processes of CMF and CMF/HEA-x. (f) 3D representations of RL and the corresponding 2D contour maps for CMF/HEA-2. Reproduced with permission [171]. Copyright 2025, Elsevier."
Fig 19
(a) Schematic illustration of the fabrication process of the hierarchical hollow SiC/SiOx micro/nanofiber sponge (HHSMS). (b) Digital photograph demonstrating the flexibility of the HHSMS. (c) HHSMS maintaining structural integrity and flexibility under a butane flame. (d) 3D mapping diagrams of SCMSs. (e) Schematic representation of the growth mechanism of HHSMS. Reproduced with permission [26]. Copyright 2025, Springer."
Fig 20
(a) Schematic illustration of the fabrication process of PMMA/PBA and PMMA/PBA@PANI sponges. (b) Polymerization process of the three monomers. (c) Schematic of the in situ self-assembly mechanism during polymerization. Reproduced with permission [178]. Copyright 2023, Elsevier. (d)Schematic illustration of the CS/CNTs/Ni3ZnC0.7 composites. (e) 3D, 2D projection images of the calculated RL and the RL values under specific thicknesses for the S30min. (f) Schematic illustration of the EMWs absorption mechanism of CS/CNTs/Ni3ZnC0.7 composites. Reproduced with permission [179]. Copyright 2024, Wiley."
Fig 21
(a) Schematic illustration of the fabrication process of the C/SiC/SiBCN composite aerogel. (b, c) SEM images of the SiBCN aerogel. (d) 3D RL map of the C/SiC/SiBCN-3 composite aerogel. (e) 2D RL contour map of the composite aerogel. Reproduced with permission [185]. Copyright 2025, Elsevier (f) SEM image of the GNS/SiC aerogel. (g) SEM image of the GNS/SiC@SiBCN aerogel. (h) Schematic diagram of the GNS/SiC aerogel framework. (i) Schematic illustration of the interfacial interaction between GNS and SiC. Reproduced with permission [186]. Copyright 2025, Elsevier. (j–m) Schematic diagrams showing the microstructural evolution mechanism of the SiC/SiOC aerogel. (n) DC conductivity of the annular samples and (o) D graphs of RL for the SiC/SiOC aerogels. Reproduced with permission [187]. Copyright 2025, Elsevier."
Fig 22
(a) Schematic illustration of the elasticity-enhancement mechanism of the cross-linked PI fiber network. (b) Inter- and intramolecular thermal iridization reactions, together with additional cross-linking reactions occurring within the PI fibers. (c–e) Compressive cyclic curves of the composite under cryogenic, ambient, and elevated temperatures. Reproduced with permission [192]. Copyright 2025, Wiley. (f) A schematic illustration of the synthesis process for preparing NrGO/Co-MnO. (g) 3D representation RL curves of NrGO/Co-MnO. (h) Computer Simulation Technology (CST) simulation results of NrGO/Co-MnO. Reproduced with permission [193]. Copyright 2024, Elsevier."
Fig 23
(a) Physicochemical mechanism underlying the etching of monolayer MXene. (b) Reaction equations illustrating the construction of CS/HAc@MXene aerogels. (c) The 3D RL of MXene with different contents. Reproduced with permission [198]. Copyright 2025, Elsevier. (d) Schematic illustration of fabricating Ni/MnO-CA. (e) 3D RL plots of Ni-CA, MnO-CA and Ni/MnO-CA. Reproduced with permission [199]. Copyright 2024, Springer."
Table 1
The performance of recently published flexible EMI shielding materials was compared."
| EMI shielding materials | Classification | EMI SET/dB | Frequency range/ GHz | Ref. |
| Ni-Cu-Al ferrite/PPy nanocomposites | Conductive Polymer | 27 | X-band | [ |
| PCPES/Cu composite film | Conductive Polymer | 59.7 | X-band | [ |
| MXene/TPU foam | Conductive Polymer | 72.2 | X-band | [ |
| C/C composites | Carbon | 80 | X-band | [ |
| Graphite/ANFs film | Carbon | 38.9 | X-band | [ |
| MXene/SWCNT composite film | Carbon | 63.3 | X-band | [ |
| CNT foamed | Carbon | 74.7 | X-band | [ |
| Ti3C2Tx MXene/PI thin films | MXene | 34.73 | X-band | [ |
| TOCNFs/MXene paper | Carbon | 49.37 | X-band | [ |
| MXene/PI Janus film | Carbon | 57 | X-band | [ |
| Porous MXene/Ni film | Carbon | 41.2 | X-band | [ |
| Cu mesh film | Metal | 40.7 | X-band | [ |
| Ag/graphene-modified carbon foam | Metal | 37.7 | X-band | [ |
| ANFs/LM/gadolinium oxide composite films | Metal | 74.3 | X-band | [ |
| LM/polyacrylamide/gelatin double network hydrogel | Metal | 75 | X-band | [ |
| SWCNTs/ poly (3, 4-ethylenedioxythiophene) film | Conductive Polymer | 55.53 | X-band | [ |
| Fe3O4/EG composite material | Carbon | 67.1 | X-band | [ |
| FeSiAl/CNF composite film | Carbon | 32 | 5–40 | [ |
| BC/MXene/HFO composite film | MXene | 67.6 | X-band | [ |
| MXene/PPy nitrile porous membrane | MXene | – | X-band | [ |
| MXene-based porous structure film | MXene | 69 | X-band | [ |
| 3D porous film | Metal | 63.57 | X-band | [ |
Table 2
The performance of recently publihed flexible EWA materials was compared."
| EWA materials | RLmin/dB | d(RLmin)/ mm | EAB/GHz | d(EAB)/mm | Filling ratio/wt% | Ref. |
| rGO@MWCNTs/Fe3O4-PVA films | −48.99 | 2.8 | 3.72 | 2.8 | 50 | [ |
| BN/Ni/CNT/WPU film | −42.4 | 2.5 | 3.12 | 1.5 | 60 | [ |
| Ti3C2Tx/Co | −49.57 | 2.5 | 2.88 | 2.5 | 40 | [ |
| CNF-(CoFe2O4/RGO) film | −38.1 | 1.6 | 6.5 | 1.6 | 35 | [ |
| PCSnf-Fe3O4 film | −43.54 | 1.3 | 6.97 | 1.3 | 11.8 | [ |
| MXene/rGO | −44.3 | 1.5 | 4.84 | 1.5 | 80 | [ |
| P3C NiCrN12 | −56.18 | 2.2 | 5.76 | 2.1 | 15 | [ |
| MXene/ANFs/Ni | −48.6 | 1.5 | 5.8 | 1.5 | 10 | [ |
| PDMS/Fe3O4/CF | −47.36 | 3.15 | 9.76 | 4.2 | 13.5 | [ |
| NiZnC/CNTs | −67.9 | 1.8 | 10.3 | 1.8 | 38 | [ |
| SiC/SiOC | −53.5 | 1.78 | 6 | 1.78 | 24 | [ |
| NrGO/Co-MnO | −51.7 | 1.9 | 4.08 | 1.9 | 19 | [ |
| Ni/Ti3C2Tx | −64.51 | 1.81 | 4.96 | 1.98 | 40 | [ |
| Fe3O4/MoS2/rGO/ Ti3C2Tx | −66.92 | 3.61 | 6.08 | 2.3 | 25 | [ |
| CS/HAc @MXene | −46.66 | 4.2 | 2.39 | 3.8 | 35 | [ |
| Ni/MnO-CA | −64.09 | 2.95 | 7.36 | 2.95 | 30 | [ |
| Polyvinyl alcohol/ANFs/CNTs | −59.12 | 1.5 | 7.3 | 2.9 | 40 | [ |
| AgNWs/N-doped rGO | −56.32 | 2.47 | 14.64 | 8.08 | 20 | [ |
| CNTs/Ti3C2Tx | −69.0 | 3.7 | 3.4 | 3.7 | 0.3 | [ |
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