Fig 1

Schematic illustration of the fabracation process of PA66/Ni@PI fabrics."

Fig 2

(a) SEM and (a1–a3) EDS mapping images of PA66/Ni@PI fabrics. (b) FTIR spectra, (c) XRD patterns, (d) Hysteresis loops, and (e) XPS spectra of PI, Ni@PI and PA66/Ni@PI fabrics. (f) High resolution XPS spectra (Ni 2p) of Ni@PI fabric. (g) Stress-strain curves of PI, Ni@PI, and PA66/Ni@PI."

Fig 3

(a–c) EMI SE and (d) Power coefficient of PI, Ni@PI, and PA66/Ni@PI fabrics in X band. (e) EMI SE of PA66/Ni@PI in X, Ku, K, and Ka bands. (f) Schematic illustration of EMI shielding mechanism in PA66/Ni@PI."

Fig 4

(a) Schematic diagram of an ideal high-temperature infrared stealth solution. (b) Infrared emissivity spectrum of an ideal selective emissive material. (c) Infrared transmittance, (d) reflectance, and (e) emissivity spectra of PA66/Ni@PI, Ni@PI and commercial nickel-based alloy."

Fig 5

(a) Demonstration setup of selective thermal radiation. (b) Blackbody radiation spectra at different temperatures. (c–e) Infrared images of bare fiberglass, Ni@PI on fiberglass, PA66/Ni@PI on fiberglass, and commercial nickel-based alloy on fiberglass stimulated at different thermal-stage temperatures (250, 300 and 350 ℃)."

Fig 6

Surface temperature evolution of Ni@PI, PA66/Ni@PI and commercial nickel-based alloy stimulated at different thermal-stage temperatures of (a, d) 250 ℃, (b, e) 300 ℃ and (c, f) 350 ℃. (g) Equilibrium surface temperatures of samples at different thermal-stage temperatures after 600 s. (h) Equilibrium surface temperature differences between Ni@PI, PA66/Ni@PI and commercial nickel-based alloy at different thermal-stage temperatures. (i) Infrared radiation temperatures of samples at thermal-stage temperature of 350 ℃."