Acta Phys. -Chim. Sin. ›› 2002, Vol. 18 ›› Issue (12): 1062-1067.doi: 10.3866/PKU.WHXB20021202

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Preparation of Au (core)-Cu (shell) Nanoparticles Assembly by Electrodeposition

Cao Lin-You;Diao Peng;Liu Zhong-Fan   

  1. Center for Nanoscale Science and Technology, College of Chemistry and Molecular Engineering, Peking University, Beijing　100871
  • Received:2002-03-28 Revised:2002-05-09 Published:2002-12-15
  • Contact: Liu Zhong-Fan E-mail:lzf@chem.pku.edu.cn

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Abstract: Submonolayer assembly of Au (core)-Cu (shell) nanoparticles was prepared by electrodeposition of Cu on Au nanoparticles assembly electrode, where AUDT＋DT mixed monolayer was used as the coupling layer between gold substrate and Au nanoparticles. Under suitable polarized potential, Cu was found to be selectively electrodeposited on Au nanoparticles rather than on the organic monolayer. At －0.03 V, Au (core)-Cu (shell) nanoparticles have good monodispersity and spherical shape until their diameters exceeded 20 nm,and the diameters of which are in good accordance with those calculated by coulometry.

Key words: Core-shell nanoparticles, Electrodeposition, Self-assembly monolayers, 　Au nanoparticles, Cu nanoparticles