物理化学学报 >> 2000, Vol. 16 >> Issue (03): 202-206.doi: 10.3866/PKU.WHXB20000303

研究论文 上一篇    下一篇

金纳米粒子在平整硅基表面上的组装

胡瑞省, 刘善堂, 朱梓华, 朱涛, 刘忠范   

  1. 北京大学化学与分子工程学院，纳米科学与技术研究中心，北京 100871
  • 收稿日期:1999-05-17 修回日期:1999-07-23 发布日期:2000-03-15
  • 通讯作者: 朱涛

Assembling Gold Nnoparticles on Ultrasmooth Silicon Surface

Hu Rui-Sheng, Liu Shan-Tang, Zhu Zi-Hua, Zhu Tao, Liu Zhong-fan   

  1. Center for Nanoscale Science and Technology,College of Chemistry and Molecular Engineering,Peking University,Beijing 100871
  • Received:1999-05-17 Revised:1999-07-23 Published:2000-03-15
  • Contact: Zhu Tao

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摘要：

采用水相硅烷化方法 ,将3-氨基丙基-三甲氧基硅烷(APS)组装在湿化学法处理的单晶硅表面上.接触角、原子力显微镜(AFM)、X射线光电子能谱(XPS)表征结果显示得到了平整均匀的具有氨基表面的自组装膜. SEM观察表明 ,16nm的金纳米粒子可以在上述氨基表面上形成均匀的亚单层排布 ,得到具有Au纳米粒子/APS/Si形式的纳米复合结构 ,进一步的处理可以使金纳米粒子在表面上的排列由随机趋于有序化.

关键词: 金纳米粒子, 硅烷化, 组装

Abstract:

Chemically-wet treated silicon substrate was modified with self-assembled monolayer of 3-aminopropyl-trimethylsilane by aqueous phase silanization, giving an ultrasmooth and homogenous surface terminated with amino groups. Colloidal gold nanoparticles (15.7±2.0 nm)were adsorbed on such a surface with a submonolayer coverage and a random particle distribution. Increases in local surface coverage and packing order were induced by capping the assembled gold nanoparticles with alkanthiol molecules in an enthanolic solution.

Key words: Gold nanoparticles, Silanization, Assembly