Acta Phys. -Chim. Sin. ›› 2004, Vol. 20 ›› Issue (05): 463-467.doi: 10.3866/PKU.WHXB20040504

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Studies on the Electrodeposition Behaviors of Palladium by the Actions of Additive

Yang Fang-Zu;Huang Ling;Xu Shu-Kai;Zhou Shao-Min   

  1. Chemistry Department, State Key Laboratory for Physical Chemistry of Solid Surfaces, Institute of Physical Chemistry, Xiamen University, Xiamen 361005
  • Received:2003-10-06 Revised:2003-12-09 Published:2004-05-15
  • Contact: Yang Fang-Zu

Abstract: The basic electrolyte solution of flash palladium plating contains of 4 g•L-1 Pd(NH3)2Cl2 and 104 g•L-1 NH4H2PO4. In the solution with or without additive the electrodeposition and electrocrystallization behaviors of palladium on glassy carbon(GC)electrode were studied by means of polarization curve, cyclic voltammetry and potentiostatic current transient. The results showed that the additive hindered the electrodeposition of palladium. The exchange current density of palladium on GC electrode was very low. The electrodeposition of palladium proceeded a nucleation. Its electrocrystallization mechanism in the electrolyte solution without additive was in tendency to nucleate progressively in three dimensions while in the electrolyte solution containing additive it was in tendency to nucleate instantaneously in three dimensions.

Key words: Palladium, Electrodeposition, Electrocrystallization, Additive, Kinetics