物理化学学报 >> 1994, Vol. 10 >> Issue (05): 452-455.doi: 10.3866/PKU.WHXB19940516

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铜在3%NaCl溶液中腐蚀行为的光电化学研究

任聚杰, 杨迈之, 童汝亭, 郭沁林, 蔡生民, 周国定   

  1. 河北师范大学化学系 050016；北京大学化学系 100871；上海电力学院动力工程系 200090
  • 收稿日期:1992-10-20 修回日期:1993-03-22 发布日期:1994-05-15
  • 通讯作者:

Photoelectrochemical Study on the Corrosion Behavior of Copper in 3% NaCl Solution

Ren Ju-Jie, Yang Mai-Zhi, Tong Ru-Ting, Guo Qin-Lin, Cai Sheng-Min, Zhou Guo-Ding   

  1. Department of Chemistry, Hebei University 050016; Department of Chemistry, Peking Univeristy 100871; Department of Thermal Power Engineering, Shanghai Institute of Electric Power 200090
  • Received:1992-10-20 Revised:1993-03-22 Published:1994-05-15
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关键词: Cu, 光电流(Iph), 开路光电压(Voph), Cl-

Abstract:

The corrosion behavior of copper in 3% NaCl solutions has been investigated using AES. XPS and photoelectrochemical tectniques. The results show that Cl~- has remarkable influence on the corrosion behavior of copper. With the increasing immersion time, the photoresponse of copper electrode changes from p-type to n-type gradually, and the invasion degree of Cl~- ions on copper electrode increases. Finally, the band gap of the sedriconduct film formed on copper electrode surface is 1.7 eV.

Key words: Cu, Photocurrent (Iph), Open circuit photovoltage (Voph), Cl-