物理化学学报 >> 2010, Vol. 26 >> Issue (05): 1457-1462.doi: 10.3866/PKU.WHXB20100532

材料物理化学 上一篇    

超疏水低粘着铜表面制备及其防覆冰性能

张友法, 余新泉, 周荃卉, 李康宁   

  1. 东南大学材料科学与工程学院, 江苏省先进金属材料高技术研究重点实验室, 南京 211189
  • 收稿日期:2009-11-18 修回日期:2010-01-19 发布日期:2010-04-29
  • 通讯作者: 张友法 E-mail:yfzhang@seu.edu.cn

Fabrication and Anti-Icing Performance of a Superhydrophobic Copper Surface with Low Adhesion

ZHANG You-Fa, YU Xin-Quan, ZHOU Quan-Hui, LI Kang-Ning   

  1. Jiangsu Key Laboratory of Advanced Metallic Materials, School of Materials Science and Engineering, Southeast University, Nanjing 211189, P. R. China
  • Received:2009-11-18 Revised:2010-01-19 Published:2010-04-29
  • Contact: ZHANG You-Fa E-mail:yfzhang@seu.edu.cn

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摘要：

用喷砂处理在铜片表面形成微米级丘陵状凹坑, 再用表面氧化处理在铜片表面制备菊花花瓣状CuO纳米片. 通过喷砂-表面氧化处理在铜片表面成功构建了微米-纳米复合结构, 这种表面氟化后与水滴的接触角高达161°, 滚动角低至1°, 显示出优异的超疏水性和很低的粘着性. 低温下, 这种表面与水滴间的热量交换较小, 水滴不易凝结, 有效地提高了抗结霜性. 抗结霜性良好的超疏水铜有望在热交换器或低温运行设备等领域获得应用, 这种简便的超疏水铜表面的制备方法也给其它工程材料超疏水表面的工业化制备提供了一个思路.

关键词: 超疏水, 铜, 低粘着, 抗结霜, 接触角

Abstract:

Microscale V-shaped impact pits are formed on copper surfaces after sandblasting. After surface oxidation, the whole copper surface is uniformly and completely covered by petal-like CuO nanosheets. Micro-and nanoscale structures are fabricated by a combination of sandblasting and surface oxidation, which leads to a high water contact angle of 161° and an ultra-low water roll angle of 1° for the surface after fluorination. Water condensation is difficult at low temperatures as heat transfer between the surface and water droplets is greatly reduced on these surfaces. This is thought to be the main reason for the improvement in ice resistance of the superhydrophobic copper surface. Superhydrophobic copper surfaces with excellent anti-icing performance can be widely used in many fields such as in heat exchange and in products operating at low temperatures. Such a facile technique is expected to be a feasible method for the industrial fabrication of superhydrophobic surfaces on other engineering materials.

Key words: Superhydrophobicity, Copper, Low adhesion, Anti-icing, Contact angle