物理化学学报 >> 2012, Vol. 28 >> Issue (03): 693-698.doi: 10.3866/PKU.WHXB201201111

催化和表面科学 上一篇    下一篇

液相法制备具有双尺寸粗糙度的超疏水铜表面

徐飞燕, 刘丽君, 覃健, 刘贝, 梅双   

  1. 武汉纺织大学化学与化工学院, 武汉 430073
  • 收稿日期:2011-11-04 修回日期:2011-12-31 发布日期:2012-02-23
  • 通讯作者: 刘丽君 E-mail:liulj@wtu.edu.cn
  • 基金资助:

    中国纺织工业协会(2011054)资助项目

Solution-Phase Synthesis of Superhydrophobic Copper Surface with Dual Scale Roughness

XU Fei-Yan, LIU Li-Jun, QIN Jian, LIU Bei, MEI Shuang   

  1. College of Chemistry and Chemical Engineering, Wuhan Textile University, Wuhan 430073, P. R. China
  • Received:2011-11-04 Revised:2011-12-31 Published:2012-02-23
  • Contact: LIU Li-Jun E-mail:liulj@wtu.edu.cn
  • Supported by:

    The project was supported by China National Textile and Apparel Council (2011054).

摘要: 基于简单的液相法, 以硫代硫酸钠和氯化铜为原料在铜片表面上构筑了具有微/纳米双尺寸粗糙度的硫化铜膜. 用X射线衍射(XRD)仪、扫描电镜(SEM)、能量色散X射线(EDX)光谱仪及光学视频接触角仪对处理前后的铜表面进行了表征和分析. 处理后的超亲水铜表面经硬脂酸修饰后具有超疏水效应, 静态接触角高达161°, 5 μL水滴滚动角低至2.5°左右. 超疏水性能归因于表面具有双尺寸粗糙度和低表面能的硬脂酸. 该方法简单, 无需复杂制备过程和苛刻设备, 所得超疏水铜表面具有优异的不粘附性、长时间储存的稳定性和一定的耐摩擦性能.

关键词: 液相法, 超疏水, 铜, 硬脂酸, 耐摩擦性

Abstract: A copper sulfide film with dual scale micro- and nano-structured roughness was constructed on copper foil via a facile solution-phase method using the sodium thiosulphate and cupric chloride as raw materials. The resulting film was characterized by X-ray diffraction (XRD), scanning electron microscopy (SEM), energy dispersive X-ray (EDX) spectrometer, and contact angle measurements. After stearic acid hydrophobization, the film exhibited a water contact angle of 161° and a sliding angle of 2.5° for a 5 μL water droplet. The superhydrophobicity was attributed to a combination of the dual scale roughness at the micro- and nano-meter levels and the low surface energy of the stearic acid coating. This is a simple synthetic methodology requiring no complex or harsh equipment. The copper surface obtained has the excellent non-sticking property, long-term storage stability, and relatively good anti-abrasion property.

Key words: Solution-phase synthesis, Superhydrophobicity, Copper, Stearic acid, Anti-abrasion